Invention Grant
- Patent Title: Compact EEPROM memory cell with a gate dielectric layer having two different thicknesses
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Application No.: US16130593Application Date: 2018-09-13
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Publication No.: US10727239B2Publication Date: 2020-07-28
- Inventor: François Tailliet
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMICROELECTRONICS (ROUSSET) SAS
- Current Assignee: STMICROELECTRONICS (ROUSSET) SAS
- Current Assignee Address: FR Rousset
- Agency: Slater Matsil, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@33040228
- Main IPC: H01L27/11517
- IPC: H01L27/11517 ; H01L29/423 ; G11C7/18 ; H01L29/66 ; G11C16/04 ; H01L21/28 ; H01L27/11524 ; H01L29/788 ; G11C16/08 ; G11C16/24

Abstract:
An EEPROM memory integrated circuit includes memory cells arranged in a memory plane. Each memory cell includes an access transistor in series with a state transistor. Each access transistor is coupled, via its source region, to the corresponding source line and each state transistor is coupled, via its drain region, to the corresponding bit line. The floating gate of each state transistor rests on a dielectric layer having a first part with a first thickness, and a second part with a second thickness that is less than the first thickness. The second part is located on the source side of the state transistor.
Public/Granted literature
- US20190088665A1 COMPACT EEPROM MEMORY CELL Public/Granted day:2019-03-21
Information query
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