Invention Grant
- Patent Title: System including hierarchical memory modules having different types of integrated circuit memory devices
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Application No.: US15691646Application Date: 2017-08-30
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Publication No.: US10755794B2Publication Date: 2020-08-25
- Inventor: Craig Hampel , Mark Horowitz
- Applicant: Rambus Inc.
- Applicant Address: US CA San Jose
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lowenstein Sandler LLP
- Main IPC: G06F12/00
- IPC: G06F12/00 ; G11C29/12 ; G06F12/08 ; G06F12/0804 ; G06F13/16 ; G11C5/04 ; G11C7/10 ; G11C29/00 ; G06F3/06 ; G06F12/0897 ; G11C29/32

Abstract:
Volatile memory devices may be on a first memory module that is coupled to a memory controller by a first signal path. A nonvolatile memory device may be on a second memory module that is coupled to the first memory module by a second signal path. A memory transaction for the nonvolatile memory device may be transferred from the memory controller to at least one of the volatile memory devices using the first signal path and data associated with the memory transaction is to be written from at least one of the volatile memory devices to the nonvolatile memory device using the second signal path and a control signal. A durability circuit may generate the control signal based on a comparison of a number of write transactions to a particular memory location with a threshold value.
Public/Granted literature
- US20170365354A1 SYSTEM INCLUDING HIERARCHICAL MEMORY MODULES HAVING DIFFERENT TYPES OF INTEGRATED CIRCUIT MEMORY DEVICES Public/Granted day:2017-12-21
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