- Patent Title: Semiconductor package device and method of manufacturing the same
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Application No.: US16058844Application Date: 2018-08-08
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Publication No.: US10756025B2Publication Date: 2020-08-25
- Inventor: Wei-Hsuan Lee , Jaw-Ming Ding , Wei-Yu Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/498 ; H01L23/00 ; H01L21/48 ; H01L21/56 ; H01L23/31
Abstract:
A semiconductor package device includes: (1) a substrate having a top surface; (2) a passive component disposed on the substrate and having a top surface; (3) an active component disposed on the substrate and having a top surface; and (4) a package body disposed on the substrate, the package body including a first portion covering the active component and the passive component, and a second portion covering the passive component, wherein a top surface of the second portion of the package body is higher than a top surface of the first portion of the package body, and the first portion and the second portion of the package body include different materials.
Public/Granted literature
- US20180350753A1 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-12-06
Information query
IPC分类:
