- Patent Title: Expediting spectral measurement in semiconductor device fabrication
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Application No.: US15568958Application Date: 2017-08-23
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Publication No.: US10761034B2Publication Date: 2020-09-01
- Inventor: Vincent Immer , Tal Marciano , Etay Lavert
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Hodgson Russ LLP
- International Application: PCT/US2017/048276 WO 20170823
- International Announcement: WO2018/067243 WO 20180412
- Main IPC: G01N21/55
- IPC: G01N21/55 ; G01N21/95 ; G01N21/956 ; G03F7/20 ; G01N21/31 ; G02B21/00 ; G02B21/08 ; G01J3/453 ; G02B21/06 ; G02B21/18 ; G02B21/36 ; H01L21/67 ; H01L21/66
Abstract:
A device and method for expediting spectral measurement in metrological activities during semiconductor device fabrication through interferometric spectroscopy of white light illumination during calibration, overlay, and recipe creation.
Public/Granted literature
- US20180372652A1 Expediting Spectral Measurement in Semiconductor Device Fabrication Public/Granted day:2018-12-27
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