Invention Grant
- Patent Title: Post-packaging environment recovery of graphics on-die memory
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Application No.: US16419449Application Date: 2019-05-22
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Publication No.: US10762978B2Publication Date: 2020-09-01
- Inventor: Altug Koker , Travis T. Schluessler , Ankur N. Shah , Abhishek R. Appu , Joydeep Ray , Jonathan Kennedy
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Jordan IP Law, LLC
- Main IPC: G11C29/00
- IPC: G11C29/00 ; G11C29/44 ; G11C29/52 ; G11C17/18 ; G11C29/12 ; G11C29/36 ; G11C29/04
Abstract:
Systems, apparatuses and methods may provide for technology that identifies a redundant portion of a packaged on-die memory and detects, during a field test of the packaged on-die memory, one or more failed cells in the packaged on-die memory. Additionally, one or more memory cells in the redundant portion may be substituted for the one or more failed memory cells.
Information query
