An electronic device includes a chip component and a metal terminal. The chip component includes an element body containing laminated internal electrodes and a terminal electrode formed outside the element body to connect with ends of the internal electrodes. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes an electrode facing portion, a holding portion, and a mount portion. A connection member connecting between the electrode facing portion and the end surface of the terminal electrode exists in a joint region in a predetermined range. A non-joint region is formed between an edge of the joint region and the holding portion. A non-joint gap between the electrode facing portion and the end surface of the terminal electrode becomes larger toward the holding portion in the non-joint region.