Invention Grant
- Patent Title: Physical vapor deposition chamber particle reduction apparatus and methods
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Application No.: US15681022Application Date: 2017-08-18
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Publication No.: US10763091B2Publication Date: 2020-09-01
- Inventor: Vibhu Jindal , Sanjay Bhat , Majeed A. Foad
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: C23C14/34
- IPC: C23C14/34 ; H01J37/34 ; C23C14/35 ; G03F1/22 ; C23C14/56 ; H01J37/32
Abstract:
Physical vapor deposition processing chambers and methods of processing a substrate such as an EUV mask blank in a physical vapor deposition chamber are disclosed. An electric field and a magnetic field are utilized to deflect particles from a substrate being processed in the chamber.
Public/Granted literature
- US20190057849A1 Physical Vapor Deposition Chamber Particle Reduction Apparatus And Methods Public/Granted day:2019-02-21
Information query
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