公开(公告)号：US10763091B2

公开(公告)日：2020-09-01

申请号：US15681022

申请日：2017-08-18

Applicant: Applied Materials, Inc.

Inventor： Vibhu Jindal ,  Sanjay Bhat ,  Majeed A. Foad

IPC: C23C14/34 ,  H01J37/34 ,  C23C14/35 ,  G03F1/22 ,  C23C14/56 ,  H01J37/32

Abstract: Physical vapor deposition processing chambers and methods of processing a substrate such as an EUV mask blank in a physical vapor deposition chamber are disclosed. An electric field and a magnetic field are utilized to deflect particles from a substrate being processed in the chamber.

公开(公告)号：US20200058213A9

公开(公告)日：2020-02-20

申请号：US16220351

申请日：2018-12-14

Applicant: Applied Materials, Inc.

Inventor： Vinayak Vishwanath Hassan ,  Majeed A. Foad ,  Cara Beasley ,  Ralf Hofmann

IPC: G08B25/00 ,  G06F17/15 ,  G08B13/196 ,  G06F16/44 ,  G06F16/435 ,  G06Q50/00 ,  G06F16/2457 ,  G06F16/25 ,  G08B31/00 ,  G06F16/248

Abstract: An extreme ultraviolet (EUV) mask blank production system includes: a substrate handling vacuum chamber for creating a vacuum; a substrate handling platform, in the vacuum, for transporting an ultra-low expansion substrate loaded in the substrate handling vacuum chamber; and multiple sub-chambers, accessed by the substrate handling platform, for forming an EUV mask blank includes: a multi-layer stack, formed above the ultra-low expansion substrate, for reflecting an extreme ultraviolet (EUV) light, and an absorber layer, formed above the multi-layer stack, for absorbing the EUV light at a wavelength of 13.5 nm includes the absorber layer has a thickness of less than 80 nm and less than 2% reflectivity.

公开(公告)号：US10551732B2

公开(公告)日：2020-02-04

申请号：US16220351

申请日：2018-12-14

Applicant: Applied Materials, Inc.

Inventor： Vinayak Vishwanath Hassan ,  Majeed A. Foad ,  Cara Beasley ,  Ralf Hofmann

IPC: G03F1/54 ,  G03F1/22 ,  G03F1/24

Abstract: An extreme ultraviolet (EUV) mask blank production system includes: a substrate handling vacuum chamber for creating a vacuum; a substrate handling platform, in the vacuum, for transporting an ultra-low expansion substrate loaded in the substrate handling vacuum chamber; and multiple sub-chambers, accessed by the substrate handling platform, for forming an EUV mask blank includes: a multi-layer stack, formed above the ultra-low expansion substrate, for reflecting an extreme ultraviolet (EUV) light, and an absorber layer, formed above the multi-layer stack, for absorbing the EUV light at a wavelength of 13.5 nm includes the absorber layer has a thickness of less than 80 nm and less than 2% reflectivity.

公开(公告)号：US09905418B2

公开(公告)日：2018-02-27

申请号：US15427367

申请日：2017-02-08

Applicant: Applied Materials, Inc.

Inventor： Cara Beasley ,  Ralf Hofmann ,  Majeed A. Foad

IPC: B05D5/12 ,  H01L21/02 ,  H01L21/288 ,  C01B31/04

CPC classification number: H01L21/02376 ,  B05D3/061 ,  B05D3/065 ,  B05D3/141 ,  B05D5/12 ,  C01B32/182 ,  C01B32/184 ,  C01B32/186 ,  C01B32/20 ,  H01L21/02318 ,  H01L21/0234 ,  H01L21/02345 ,  H01L21/0237 ,  H01L21/02527 ,  H01L21/02628 ,  H01L21/02664 ,  H01L21/288

Abstract: Embodiments described herein provide methods and apparatus for forming graphitic carbon such as graphene on a substrate. The method includes providing a precursor comprising a linear conjugated hydrocarbon, depositing a hydrocarbon layer from the precursor on the substrate, and forming graphene from the hydrocarbon layer by applying energy to the substrate. The precursor may include template molecules such as polynuclear aromatics, and may be deposited on the substrate by spinning on, by spraying, by flowing, by dipping, or by condensing. The energy may be applied as radiant energy, thermal energy, or plasma energy.

公开(公告)号：US09739913B2

公开(公告)日：2017-08-22

申请号：US14696322

申请日：2015-04-24

Applicant: Applied Materials, Inc.

Inventor： Cara Beasley ,  Ralf Hofmann ,  Majeed A. Foad ,  Rudy Beckstrom, III

IPC: G02B5/08 ,  G02B1/14 ,  G03F7/20

CPC classification number: G02B5/0891 ,  C23C14/083 ,  C23C14/14 ,  C23C14/568 ,  C23C14/5853 ,  C23C14/5873 ,  C23C28/32 ,  C23C28/3455 ,  G02B1/14 ,  G02B5/0816 ,  G02B5/085 ,  G03F1/24 ,  G03F1/48 ,  G03F7/20 ,  G03F7/70316 ,  G03F7/70916 ,  G03F7/70958 ,  G21K1/062

Abstract: A method of manufacture of an extreme ultraviolet reflective element includes: providing a substrate; forming a multilayer stack on the substrate, the multilayer stack includes a plurality of reflective layer pairs having a first reflective layer and a second reflective layer for forming a Bragg reflector; and forming a capping layer on and over the multilayer stack, the capping layer formed from titanium oxide, ruthenium oxide, niobium oxide, ruthenium tungsten, ruthenium molybdenum, or ruthenium niobium, and the capping layer for protecting the multilayer stack by reducing oxidation and mechanical erosion.

公开(公告)号：US09343347B2

公开(公告)日：2016-05-17

申请号：US14018959

申请日：2013-09-05

Applicant: APPLIED MATERIALS, INC.

Inventor： Dieter Haas ,  Majeed A. Foad ,  Ralf Hofmann

IPC: H01L21/683

CPC classification number: H01L21/6833 ,  H01L21/6831

Abstract: Embodiments of a portable electrostatic chuck for use in a substrate process chamber to support an ultra-thin substrate when disposed thereon are provided herein. In some embodiments, a portable electrostatic chuck may include a carrier comprising a dielectric material; an electrically conductive layer disposed on a top surface of the carrier; a dielectric layer disposed over the electrically conductive layer, such that the electrically conductive layer is disposed between the carrier and the dielectric layer; and at least one conductor coupled to the electrically conductive layer, wherein the portable electrostatic chuck is configured to electrostatically retain the ultra-thin substrate to the portable electrostatic chuck, wherein the portable electrostatic chuck is further configured to be handled and moved by substrate processing equipment outside of the substrate process chamber, and wherein the portable electrostatic chuck is sized to support large ultra-thin substrates.

Abstract translation: 本文提供了一种用于基板处理室中用于支撑超薄基板的便携式静电卡盘的实施例。 在一些实施例中，便携式静电卡盘可以包括包括电介质材料的载体; 设置在所述载体的顶表面上的导电层; 设置在所述导电层上的电介质层，使得所述导电层设置在所述载体和所述电介质层之间; 以及耦合到所述导电层的至少一个导体，其中所述便携式静电卡盘被配置为将所述超薄基板静电保持到所述便携式静电卡盘，其中所述便携式静电卡盘进一步构造成由基板处理设备 在基板处理室外部，并且其中便携式静电卡盘的尺寸被设计成支撑大的超薄基板。

公开(公告)号：US20160011344A1

公开(公告)日：2016-01-14

申请号：US14696322

申请日：2015-04-24

Applicant: Applied Materials, Inc.

Inventor： Cara Beasley ,  Ralf Hofmann ,  Majeed A. Foad ,  Rudy Beckstrom, III

IPC: G02B5/08 ,  G02B1/14

CPC classification number: G02B5/0891 ,  C23C14/083 ,  C23C14/14 ,  C23C14/568 ,  C23C14/5853 ,  C23C14/5873 ,  C23C28/32 ,  C23C28/3455 ,  G02B1/14 ,  G02B5/0816 ,  G02B5/085 ,  G03F1/24 ,  G03F1/48 ,  G03F7/20 ,  G03F7/70316 ,  G03F7/70916 ,  G03F7/70958 ,  G21K1/062

Abstract: A method of manufacture of an extreme ultraviolet reflective element includes: providing a substrate; forming a multilayer stack on the substrate, the multilayer stack includes a plurality of reflective layer pairs having a first reflective layer and a second reflective layer for forming a Bragg reflector; and forming a capping layer on and over the multilayer stack, the capping layer formed from titanium oxide, ruthenium oxide, niobium oxide, ruthenium tungsten, ruthenium molybdenum, or ruthenium niobium, and the capping layer for protecting the multilayer stack by reducing oxidation and mechanical erosion.

Abstract translation: 一种制造极紫外反射元件的方法包括：提供基底; 在所述衬底上形成多层叠层，所述多层叠层包括多个具有第一反射层和用于形成布拉格反射器的第二反射层的反射层对; 在多层堆叠上形成覆盖层，由氧化钛，氧化钌，氧化铌，钌钨，钌钼或钌铌形成的覆盖层，以及通过还原氧化和机械保护多层叠层的覆盖层 侵蚀。

公开(公告)号：US10691013B2

公开(公告)日：2020-06-23

申请号：US15031677

申请日：2014-12-19

Applicant: Applied Materials, Inc.

Inventor： Majeed A. Foad

IPC: G03F7/20 ,  G03F1/22 ,  H01L21/683 ,  G03F1/60

Abstract: An EUV lithography system and method of manufacturing thereof includes: an EUV light source; a chuck being thermally conducting and smooth having a surface with a predetermined chuck flatness; and a reflective lens system for directing EUV light from the EUV light source over the surface of the chuck.

公开(公告)号：US09870935B2

公开(公告)日：2018-01-16

申请号：US14839656

申请日：2015-08-28

Applicant: Applied Materials, Inc.

Inventor： Edward W. Budiarto ,  Majeed A. Foad ,  Ralf Hofmann ,  Thomas Nowak ,  Todd Egan ,  Mehdi Vaez-Iravani

IPC: H01L21/00 ,  H01L21/67 ,  H01L21/02 ,  H01L21/033 ,  H01L21/285 ,  H01L21/66

CPC classification number: H01L21/67253 ,  G03F1/22 ,  G03F1/24 ,  H01L21/02631 ,  H01L21/0332 ,  H01L21/0337 ,  H01L21/2855 ,  H01L22/12 ,  H01L22/26

Abstract: A monitoring and deposition control system and method of operation thereof including: a deposition chamber for depositing a material layer on a substrate; a sensor array for monitoring deposition of the material layer for changes in a layer thickness of the material layer during deposition; and a processing unit for adjusting deposition parameters based on the changes in the layer thickness during deposition.

公开(公告)号：US20170365288A1

公开(公告)日：2017-12-21

申请号：US15627124

申请日：2017-06-19

Applicant: Applied Materials, Inc.

Inventor： Majeed A. Foad ,  Jacob Newman ,  Jose Antonio Marin ,  Daniel J. Hoffman ,  Stephen Moffatt ,  Steven Verhaverbeke

IPC: G11B5/82 ,  C23C16/00 ,  C23F1/00 ,  H01L21/673 ,  G11B5/855 ,  G11B5/84 ,  H01L21/677 ,  H01L21/687 ,  C23C14/48 ,  C23C14/50

CPC classification number: G11B5/82 ,  C23C14/48 ,  C23C14/50 ,  C23C16/00 ,  C23F1/00 ,  G11B5/84 ,  G11B5/855 ,  H01L21/673 ,  H01L21/677 ,  H01L21/687

Abstract: Methods and apparatus for forming substrates having magnetically patterned surfaces is provided. A magnetic layer comprising one or more materials having magnetic properties is formed on a substrate. The magnetic layer is subjected to a patterning process in which selected portions of the surface of the magnetic layer are altered such that the altered portions have different magnetic properties from the non-altered portions without changing the topography of the substrate. A protective layer and a lubricant layer are deposited over the patterned magnetic layer. The patterning is accomplished through a number of processes that expose substrates to energy of varying forms. Apparatus and methods disclosed herein enable processing of two major surfaces of a substrate simultaneously, or sequentially by flipping. In some embodiments, magnetic properties of the substrate surface may be uniformly altered by plasma exposure and then selectively restored by exposure to patterned energy.