Invention Grant
- Patent Title: Wafer carrier, method for manufacturing the same and method for carrying a wafer
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Application No.: US15915849Application Date: 2018-03-08
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Publication No.: US10763151B2Publication Date: 2020-09-01
- Inventor: Francisco Javier Santos Rodriguez , Roland Rupp , Ronny Kern , Josef Unterweger
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; B23B31/30
Abstract:
A wafer carrier comprises a first foil, a second foil, and a chamber between the first and the second foil. The first foil has a perforation and is used for carrying the wafer. The first and the second foil are connected to each other so as to form the chamber. The chamber is configured to be evacuated to form a vacuum in the chamber, the vacuum causes an underpressure at the perforation, the underpressure forms a carrying force to the wafer to be carried.
Public/Granted literature
- US20180197766A1 Wafer Carrier, Method for Manufacturing the Same and Method for Carrying a Wafer Public/Granted day:2018-07-12
Information query
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