Invention Grant
- Patent Title: Device including a semiconductor chip monolithically integrated with a driver circuit in a semiconductor material
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Application No.: US15646189Application Date: 2017-07-11
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Publication No.: US10763246B2Publication Date: 2020-09-01
- Inventor: Ralf Otremba , Klaus Schiess , Oliver Haeberlen , Matteo-Alessandro Kutschak
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L25/11 ; H01L25/10 ; H01L23/31 ; H01L23/00 ; H01L23/14 ; H01L21/48 ; H01L23/538 ; H01L25/00 ; H01L25/065 ; H01L25/16 ; H01L27/088 ; H01L21/56
Abstract:
A device includes a driver circuit, a first semiconductor chip monolithically integrated with the driver circuit in a first semiconductor material, and a second semiconductor chip integrated in a second semiconductor material. The second semiconductor material is a compound semiconductor.
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