• Patent Title: Chip capacitor and method for manufacturing the same
  • Application No.: US16385876
    Application Date: 2019-04-16
  • Publication No.: US10777360B2
    Publication Date: 2020-09-15
  • Inventor: Hiroyuki OkadaYasuhiro Fuwa
  • Applicant: ROHM CO., LTD.
  • Applicant Address: JP Kyoto
  • Assignee: ROHM CO., LTD.
  • Current Assignee: ROHM CO., LTD.
  • Current Assignee Address: JP Kyoto
  • Agency: Rabin & Berdo, P.C.
  • Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6ae73e7f com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@44f94d5a com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@377adf09 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3711d089 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@645604d2 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6acb069f com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@b281e58
  • Main IPC: H01G4/38
  • IPC: H01G4/38 H01G4/33 H01G4/40 H01G5/38 H01G4/015 H01L27/01 H01L49/02 H01G5/011
Chip capacitor and method for manufacturing the same
Abstract:
A chip capacitor and a method for manufacturing the chip capacitor, where the chip capacitor includes a substrate, a first external electrode disposed on the substrate, a second external electrode disposed on the substrate, capacitor elements formed on the substrate and connected between the first external electrode and the second external electrode, and fuses that are formed on the substrate, are each interposed between the capacitor elements and the first external electrode or the second external electrode, and are capable of disconnecting each of the capacitor elements.
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