Invention Grant
- Patent Title: Multi-column spacing for photomask and reticle inspection and wafer print check verification
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Application No.: US15879120Application Date: 2018-01-24
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Publication No.: US10777377B2Publication Date: 2020-09-15
- Inventor: Robert Haynes , Frank Chilese , Moshe E. Preil
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: H01J37/06
- IPC: H01J37/06 ; H01J37/28 ; H01J37/20 ; G03F1/86 ; H01J37/244 ; H01L21/66

Abstract:
A multi-column assembly for a scanning electron microscopy (SEM) system is disclosed. The multi-column assembly includes a plurality of electron-optical columns arranged in an array defined by one or more spacings. Each electron-optical column includes one or more electron-optical elements. The plurality of electron-optical columns is configured to characterize one or more field areas on a surface of a sample secured on a stage. The number of electron-optical columns in the plurality of electron-optical columns equals an integer number of inspection areas in a field area of the one or more field areas. The one or more spacings of the plurality of electron-optical columns correspond to one or more dimensions of the inspection areas.
Public/Granted literature
- US20180233318A1 Multi-Column Spacing for Photomask and Reticle Inspection and Wafer Print Check Verification Public/Granted day:2018-08-16
Information query