Invention Grant
- Patent Title: Hybrid substrate carrier
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Application No.: US15815673Application Date: 2017-11-16
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Publication No.: US10777442B2Publication Date: 2020-09-15
- Inventor: Sriskantharajah Thirunavukarasu , Shoju Vayyapron , Anand Mahadev , Shankeerthan Kalyanasundaram , Eng Sheng Peh
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Main IPC: H01L21/3065
- IPC: H01L21/3065 ; H01L21/683 ; H01L21/687 ; H01L21/673 ; H01L21/00 ; H01L21/311 ; H02N13/00
Abstract:
Embodiments of a hybrid substrate carrier are provided herein. In some embodiments, a substrate carrier includes: a carrier ring having an inner ledge adjacent a central opening of the carrier ring; and a carrier plate having a diameter greater than central opening and configured to rest upon the inner ledge, wherein the carrier plate includes an electrode disposed beneath a support surface to electrostatically clamp a substrate to the support surface of the carrier plate.
Public/Granted literature
- US20180144969A1 HYBRID SUBSTRATE CARRIER Public/Granted day:2018-05-24
Information query
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