公开(公告)号：US20200017972A1

公开(公告)日：2020-01-16

申请号：US16584707

申请日：2019-09-26

Applicant: Applied Materials, Inc.

Inventor： Rohit Mishra ,  Siva Suri Chandra Rao Bhesetti ,  Eng Sheng Peh ,  Sriskantharajah Thirunavukarasu ,  Shoju Vayyapron ,  Cheng Sun

IPC: C23C16/50 ,  H01J37/32 ,  C23C16/455

Abstract: A nozzle for uniform plasma processing comprises an inlet portion and an outlet portion. The inlet portion has a side surface substantially parallel to a vertical axis. The inlet portion comprises a plurality of gas channels. The outlet portion is coupled to the inlet portion. The outlet portion comprises a plurality of outlets. At least one of the outlets is at an angle other than a right angle relative to the vertical axis.

公开(公告)号：US10465288B2

公开(公告)日：2019-11-05

申请号：US14461318

申请日：2014-08-15

Applicant: Applied Materials, Inc.

Inventor： Rohit Mishra ,  Siva Suri Chandra Rao Bhesetti ,  Eng Sheng Peh ,  Sriskantharajah Thirunavukarasu ,  Shoju Vayyapron ,  Cheng Sun

IPC: C23C16/50 ,  H01J37/32 ,  C23C16/455

Abstract: A nozzle for uniform plasma processing comprises an inlet portion and an outlet portion. The inlet portion has a side surface substantially parallel to a vertical axis. The inlet portion comprises a plurality of gas channels. The outlet portion is coupled to the inlet portion. The outlet portion comprises a plurality of outlets. At least one of the outlets is at an angle other than a right angle relative to the vertical axis.

公开(公告)号：US11053590B2

公开(公告)日：2021-07-06

申请号：US16584707

申请日：2019-09-26

Applicant: Applied Materials, Inc.

Inventor： Rohit Mishra ,  Siva Suri Chandra Rao Bhesetti ,  Eng Sheng Peh ,  Sriskantharajah Thirunavukarasu ,  Shoju Vayyapron ,  Cheng Sun

IPC: H01J37/32 ,  C23C16/50 ,  C23C16/455

Abstract: A nozzle for uniform plasma processing comprises an inlet portion and an outlet portion. The inlet portion has a side surface substantially parallel to a vertical axis. The inlet portion comprises a plurality of gas channels. The outlet portion is coupled to the inlet portion. The outlet portion comprises a plurality of outlets. At least one of the outlets is at an angle other than a right angle relative to the vertical axis.

公开(公告)号：US10777442B2

公开(公告)日：2020-09-15

申请号：US15815673

申请日：2017-11-16

Applicant: APPLIED MATERIALS, INC.

Inventor： Sriskantharajah Thirunavukarasu ,  Shoju Vayyapron ,  Anand Mahadev ,  Shankeerthan Kalyanasundaram ,  Eng Sheng Peh

IPC: H01L21/3065 ,  H01L21/683 ,  H01L21/687 ,  H01L21/673 ,  H01L21/00 ,  H01L21/311 ,  H02N13/00

Abstract: Embodiments of a hybrid substrate carrier are provided herein. In some embodiments, a substrate carrier includes: a carrier ring having an inner ledge adjacent a central opening of the carrier ring; and a carrier plate having a diameter greater than central opening and configured to rest upon the inner ledge, wherein the carrier plate includes an electrode disposed beneath a support surface to electrostatically clamp a substrate to the support surface of the carrier plate.

公开(公告)号：US10325790B2

公开(公告)日：2019-06-18

申请号：US15811575

申请日：2017-11-13

Applicant: APPLIED MATERIALS, INC.

Inventor： Eng Sheng Peh ,  Sriskantharajah Thirunavukarasu ,  Jun-Liang Su ,  Shoju Vayyapron ,  Karthik Elumalai ,  Dimantha Rajapaksa ,  Arunkumar M Tatti

IPC: H01L21/00 ,  H01L21/67 ,  H05B3/00 ,  H01L21/687 ,  H01L21/683

Abstract: Embodiments of methods and apparatus for correcting substrate deformity are provided herein. In some embodiments, a substrate support includes a base having an interior volume formed by walls extending upward from the base; a plurality of infrared lamps disposed within the interior volume; a support plate disposed above the plurality of infrared lamps, wherein the support plate includes a support surface to support a substrate; and a cover plate disposed atop the support plate and having a central opening corresponding to the support surface and an exhaust portion at a periphery of a top surface of the cover plate, wherein the exhaust portion includes a plurality of perforations fluidly coupling a space above the cover plate with an exhaust conduit formed in the cover plate. Embodiments of a showerhead assembly and processing equipment incorporating the inventive substrate support and showerhead assembly are additionally provided herein.