公开(公告)号：US10777442B2

公开(公告)日：2020-09-15

申请号：US15815673

申请日：2017-11-16

Applicant: APPLIED MATERIALS, INC.

Inventor： Sriskantharajah Thirunavukarasu ,  Shoju Vayyapron ,  Anand Mahadev ,  Shankeerthan Kalyanasundaram ,  Eng Sheng Peh

IPC: H01L21/3065 ,  H01L21/683 ,  H01L21/687 ,  H01L21/673 ,  H01L21/00 ,  H01L21/311 ,  H02N13/00

Abstract: Embodiments of a hybrid substrate carrier are provided herein. In some embodiments, a substrate carrier includes: a carrier ring having an inner ledge adjacent a central opening of the carrier ring; and a carrier plate having a diameter greater than central opening and configured to rest upon the inner ledge, wherein the carrier plate includes an electrode disposed beneath a support surface to electrostatically clamp a substrate to the support surface of the carrier plate.