Invention Grant
- Patent Title: Electronic device and manufacturing method thereof
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Application No.: US16057048Application Date: 2018-08-07
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Publication No.: US10778819B2Publication Date: 2020-09-15
- Inventor: Seong-Hyeon Kim , Hyo-Sung Kang , Min-Yong Kim , Hyun-Young Roh , Jung-Bae Park , Tae-Young Bae , Hyo-Won Seo , Hae-Won Sung , Gyung-Hoon Lee , Bit-Na Kim , Byung-Joon Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR
- Agency: The Farrell Law Firm, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7a1bddba
- Main IPC: H04M1/02
- IPC: H04M1/02 ; G06F1/16 ; H04M1/18
Abstract:
Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.
Public/Granted literature
- US20180343332A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-11-29
Information query
