公开(公告)号：US12069193B2

公开(公告)日：2024-08-20

申请号：US17362368

申请日：2021-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seong-Hyeon Kim ,  Hyo-Sung Kang ,  Min-Yong Kim ,  Hyun-Young Roh ,  Jung-Bae Park ,  Tae-Young Bae ,  Hyo-Won Seo ,  Hae-Won Sung ,  Gyung-Hoon Lee ,  Bit-Na Kim ,  Byung-Joon Lee

IPC: H04M1/02 ,  G06F1/16 ,  H04M1/18

CPC classification number: H04M1/0249 ,  G06F1/1637 ,  G06F1/1656 ,  H04M1/0266 ,  H04M1/185

Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.

公开(公告)号：US10778819B2

公开(公告)日：2020-09-15

申请号：US16057048

申请日：2018-08-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seong-Hyeon Kim ,  Hyo-Sung Kang ,  Min-Yong Kim ,  Hyun-Young Roh ,  Jung-Bae Park ,  Tae-Young Bae ,  Hyo-Won Seo ,  Hae-Won Sung ,  Gyung-Hoon Lee ,  Bit-Na Kim ,  Byung-Joon Lee

IPC: H04M1/02 ,  G06F1/16 ,  H04M1/18

Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.

公开(公告)号：US11082545B2

公开(公告)日：2021-08-03

申请号：US17020291

申请日：2020-09-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seong-Hyeon Kim ,  Hyo-Sung Kang ,  Min-Yong Kim ,  Hyun-Young Roh ,  Jung-Bae Park ,  Tae-Young Bae ,  Hyo-Won Seo ,  Hae-Won Sung ,  Gyung-Hoon Lee ,  Bit-Na Kim ,  Byung-Joon Lee

IPC: H04M1/02 ,  G06F1/16 ,  H04M1/18

Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.

公开(公告)号：US09846457B2

公开(公告)日：2017-12-19

申请号：US14695943

申请日：2015-04-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seong-Hyeon Kim ,  Jung-Bae Park

IPC: H05K7/00 ,  G06F1/16

CPC classification number: G06F1/1656 ,  G06F1/1633

Abstract: A housing assembly structure is provided. The housing assembly structure includes a first housing, a second housing assembled with the first housing, a protrusion accommodating recess formed in the first housing, a hooking protrusion formed in the second housing to be accommodated in the protrusion accommodating recess in a protruding manner, and at least one contact protrusion formed in at least one area of the hooking protrusion in a protruding manner, wherein when the hooking protrusion is accommodated in the protrusion accommodating recess, the at least one contact protrusion is in contact with an inner surface of the protrusion accommodating recess.