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Patent Agency Ranking
公开(公告)号：US10778819B2
公开(公告)日：2020-09-15
申请号：US16057048
申请日：2018-08-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seong-Hyeon Kim , Hyo-Sung Kang , Min-Yong Kim , Hyun-Young Roh , Jung-Bae Park , Tae-Young Bae , Hyo-Won Seo , Hae-Won Sung , Gyung-Hoon Lee , Bit-Na Kim , Byung-Joon Lee
Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.
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公开(公告)号：US12069193B2
公开(公告)日：2024-08-20
申请号：US17362368
申请日：2021-06-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seong-Hyeon Kim , Hyo-Sung Kang , Min-Yong Kim , Hyun-Young Roh , Jung-Bae Park , Tae-Young Bae , Hyo-Won Seo , Hae-Won Sung , Gyung-Hoon Lee , Bit-Na Kim , Byung-Joon Lee
CPC classification number: H04M1/0249 , G06F1/1637 , G06F1/1656 , H04M1/0266 , H04M1/185
Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.
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公开(公告)号：US20150313029A1
公开(公告)日：2015-10-29
申请号：US14695943
申请日：2015-04-24
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seong-Hyeon KIM , Jung-Bae Park
CPC classification number: G06F1/1656 , G06F1/1633
Abstract: A housing assembly structure is provided. The housing assembly structure includes a first housing, a second housing assembled with the first housing, a protrusion accommodating recess formed in the first housing, a hooking protrusion formed in the second housing to be accommodated in the protrusion accommodating recess in a protruding manner, and at least one contact protrusion formed in at least one area of the hooking protrusion in a protruding manner, wherein when the hooking protrusion is accommodated in the protrusion accommodating recess, the at least one contact protrusion is in contact with an inner surface of the protrusion accommodating recess.
Abstract translation: 提供了一种壳体组装结构。 壳体组件结构包括第一壳体，与第一壳体组装的第二壳体，形成在第一壳体中的突起容纳凹部，形成在第二壳体中的突出突起，以突出的方式容纳在突起容纳凹部中;以及 所述至少一个接触突起以突出的方式形成在所述钩状突起的至少一个区域中，其中当所述钩状突起容纳在所述突起容纳凹部中时，所述至少一个接触突起与所述突起容纳的内表面接触 休息。
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公开(公告)号：US11082545B2
公开(公告)日：2021-08-03
申请号：US17020291
申请日：2020-09-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seong-Hyeon Kim , Hyo-Sung Kang , Min-Yong Kim , Hyun-Young Roh , Jung-Bae Park , Tae-Young Bae , Hyo-Won Seo , Hae-Won Sung , Gyung-Hoon Lee , Bit-Na Kim , Byung-Joon Lee
Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.
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公开(公告)号：US09846457B2
公开(公告)日：2017-12-19
申请号：US14695943
申请日：2015-04-24
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seong-Hyeon Kim , Jung-Bae Park
CPC classification number: G06F1/1656 , G06F1/1633
Abstract: A housing assembly structure is provided. The housing assembly structure includes a first housing, a second housing assembled with the first housing, a protrusion accommodating recess formed in the first housing, a hooking protrusion formed in the second housing to be accommodated in the protrusion accommodating recess in a protruding manner, and at least one contact protrusion formed in at least one area of the hooking protrusion in a protruding manner, wherein when the hooking protrusion is accommodated in the protrusion accommodating recess, the at least one contact protrusion is in contact with an inner surface of the protrusion accommodating recess.
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