公开(公告)号：US10778819B2

公开(公告)日：2020-09-15

申请号：US16057048

申请日：2018-08-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seong-Hyeon Kim ,  Hyo-Sung Kang ,  Min-Yong Kim ,  Hyun-Young Roh ,  Jung-Bae Park ,  Tae-Young Bae ,  Hyo-Won Seo ,  Hae-Won Sung ,  Gyung-Hoon Lee ,  Bit-Na Kim ,  Byung-Joon Lee

IPC: H04M1/02 ,  G06F1/16 ,  H04M1/18

Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.

公开(公告)号：US12069193B2

公开(公告)日：2024-08-20

申请号：US17362368

申请日：2021-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seong-Hyeon Kim ,  Hyo-Sung Kang ,  Min-Yong Kim ,  Hyun-Young Roh ,  Jung-Bae Park ,  Tae-Young Bae ,  Hyo-Won Seo ,  Hae-Won Sung ,  Gyung-Hoon Lee ,  Bit-Na Kim ,  Byung-Joon Lee

IPC: H04M1/02 ,  G06F1/16 ,  H04M1/18

CPC classification number: H04M1/0249 ,  G06F1/1637 ,  G06F1/1656 ,  H04M1/0266 ,  H04M1/185

Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.

公开(公告)号：US11082545B2

公开(公告)日：2021-08-03

申请号：US17020291

申请日：2020-09-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seong-Hyeon Kim ,  Hyo-Sung Kang ,  Min-Yong Kim ,  Hyun-Young Roh ,  Jung-Bae Park ,  Tae-Young Bae ,  Hyo-Won Seo ,  Hae-Won Sung ,  Gyung-Hoon Lee ,  Bit-Na Kim ,  Byung-Joon Lee

IPC: H04M1/02 ,  G06F1/16 ,  H04M1/18

Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.