Invention Grant
- Patent Title: Solid-state imaging device
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Application No.: US16511876Application Date: 2019-07-15
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Publication No.: US10778918B2Publication Date: 2020-09-15
- Inventor: Takashi Abe , Nobuo Nakamura , Tomoyuki Umeda , Keiji Mabuchi , Hiroaki Fujita , Eiichi Funatsu , Hiroki Sato
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@21ec7718
- Main IPC: H04N5/374
- IPC: H04N5/374 ; H04N5/376 ; H04N3/14 ; H04N9/04 ; H04N5/335 ; H04N5/378 ; H04N5/3745

Abstract:
A solid-state imaging device is capable of simplifying the pixel structure to reduce the pixel size and capable of suppressing the variation in the characteristics between the pixels when a plurality of output systems is provided. A unit cell includes two pixels. Upper and lower photoelectric converters and, transfer transistors and connected to the upper and lower photoelectric converters, respectively, a reset transistor, and an amplifying transistor form the two pixels. A full-face signal line is connected to the respective drains of the reset transistor and the amplifying transistor. Controlling the full-face signal line, along with transfer signal lines and a reset signal line, to read out signals realizes the simplification of the wiring in the pixel, the reduction of the pixel size, and so on.
Public/Granted literature
- US20190342512A1 SOLID-STATE IMAGING DEVICE Public/Granted day:2019-11-07
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