Invention Grant
- Patent Title: Gas cooled electrostatic chuck (ESC) having a gas channel formed therein and coupled to a gas box on both ends of the gas channel
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Application No.: US14567161Application Date: 2014-12-11
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Publication No.: US10781518B2Publication Date: 2020-09-22
- Inventor: Brian T. West , Manoj A. Gajendra , Soundarrajan Jembulingam
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; C23C16/46 ; H01L21/683 ; C23C16/458 ; C23C14/50 ; H01J37/32
Abstract:
Embodiments of the disclosure include an electrostatic chuck assembly, a processing chamber and a method of maintaining a temperature of a substrate is provided. In one embodiment, an electrostatic chuck assembly is provided that includes an electrostatic chuck, a cooling plate and a gas box. The cooling plate includes a gas channel formed therein. The gas box is operable to control a flow of cooling gas through the gas channel.
Public/Granted literature
- US20160172226A1 GAS COOLED MINIMAL CONTACT AREA(MCA) ELECTROSTATIC CHUCK(ESC) FOR ALUMINUM NITRIDE(ALN) PVD PROCESS Public/Granted day:2016-06-16
Information query
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