- 专利标题: Probe assembly and testing device
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申请号: US15971484申请日: 2018-05-04
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公开(公告)号: US10782314B2公开(公告)日: 2020-09-22
- 发明人: Pijian Cheng , Jing Xue , Hongyan Xing , Yanyan Yin , Yue Gu , Yubing Song
- 申请人: BOE TECHNOLOGY GROUP CO., LTD. , BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- 申请人地址: CN Beijing CN Beijing
- 专利权人: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- 当前专利权人: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- 当前专利权人地址: CN Beijing CN Beijing
- 代理机构: Brooks Kushman P.C.
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6afbf32c
- 主分类号: G01Q70/02
- IPC分类号: G01Q70/02 ; G01R1/067 ; G01Q70/10 ; G01Q70/14 ; G01Q70/16 ; G01R1/073
摘要:
A probe assembly is provided, which is applied to an electrical testing device. The probe assembly includes a probe body, which includes a testing end configured to contact with a to-be-tested device and a connection end opposite to the testing end; an elastic connection structure configured to be deformed when the probe body is subjected to a pressure; and a fixing base. The connection end is fixedly connected to the fixing base via the elastic connection structure. A testing device is further provided.
公开/授权文献
- US20190064212A1 PROBE ASSEMBLY AND TESTING DEVICE 公开/授权日:2019-02-28
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