Invention Grant
- Patent Title: High-frequency ceramic board and high-frequency semiconductor element package
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Application No.: US16230240Application Date: 2018-12-21
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Publication No.: US10790245B2Publication Date: 2020-09-29
- Inventor: Noboru Kubo , Naoki Goto
- Applicant: NGK ELECTRONICS DEVICES, INC. , NGK INSULATORS, LTD.
- Applicant Address: JP Yamaguchi JP Aichi
- Assignee: NGK ELECTRONICS DEVICES, INC.,NGK INSULATORS, LTD.
- Current Assignee: NGK ELECTRONICS DEVICES, INC.,NGK INSULATORS, LTD.
- Current Assignee Address: JP Yamaguchi JP Aichi
- Agency: Nakanishi IP Associates, LLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@13cf3e7f
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L23/66 ; H01L23/13 ; H01L23/15 ; H01L23/02 ; H05K1/02 ; H01L23/498 ; H01L23/057
Abstract:
A highly reliable high-frequency ceramic board appropriately transmitting signals with high frequencies up to 50 GHz includes a flat ceramic substrate, a pair of ground lines bonded to a peripheral portion of a back surface of the ceramic substrate, a first lead pad electrode bonding the ground lines, at least one pair of signal lines between the ground lines, second lead pad electrodes attached where the signal lines are bonded, and a groove-like recess between the second lead pad electrodes. The pair of signal lines forms a differential transmission line. An interval LGS between a first edge of the first lead pad electrode and a second edge of a corresponding second lead pad electrode and an interval LSS between facing second edges satisfy LSS
Public/Granted literature
- US20190148316A1 HIGH-FREQUENCY CERAMIC BOARD AND HIGH-FREQUENCY SEMICONDUCTOR ELEMENT PACKAGE Public/Granted day:2019-05-16
Information query
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