公开(公告)号：US12209313B2

公开(公告)日：2025-01-28

申请号：US17447322

申请日：2021-09-10

Applicant: NGK Electronics Devices, Inc. ,  NGK Insulators, Ltd.

Inventor： Shigeru Yoshimura

IPC: H01L21/48 ,  C23C18/16 ,  C23C18/32 ,  C23C18/42 ,  C23C18/50 ,  H01L23/14 ,  H01L23/373

Abstract: A metal member includes a metal substrate, a first intermediate plating layer, a second intermediate plating layer, and a precious metal plating layer. The metal substrate includes a surface constituted of a plurality of crystal grains. The first intermediate plating layer is directly formed on the plurality of crystal grains of the metal substrate, contains a nickel element, and is non-oriented with respect to each crystal orientation of the plurality of crystal grains of the metal substrate. The second intermediate plating layer is directly formed on the first intermediate plating layer. The precious metal plating layer is formed on the second intermediate plating layer.

公开(公告)号：US20250024592A1

公开(公告)日：2025-01-16

申请号：US18898781

申请日：2024-09-27

Applicant: NGK ELECTRONICS DEVICES, INC. ,  NGK INSULATORS, LTD.

Inventor： Hiroshi KOUNO ,  Atsushi MASE

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18

Abstract: The electroconductive portion has a structure including: an electroconductive phase, which is made of a metal component containing at least one of W or Mo and has a plurality of air gaps dispersed so as to be separated from each other; and glass phases, which are contained in at least some of the plurality of air gaps and have an area ratio of 3% or more and 20% or less on a cross section of the plate-shaped portion taken in a thickness direction. A proportion of the number of the glass phases, each having an aspect ratio of 1.5 or less, to a total number of the glass phases on the cross section of the plate-shaped portion taken in the thickness direction is 40% or more.

公开(公告)号：US11929301B2

公开(公告)日：2024-03-12

申请号：US17700717

申请日：2022-03-22

Applicant: NGK ELECTRONICS DEVICES, INC. ,  NGK INSULATORS, LTD.

Inventor： Naoya Shirai ,  Yoshikazu Mihara ,  Noriyasu Yamamoto

IPC: H01L23/367 ,  H01L23/373

CPC classification number: H01L23/3675 ,  H01L23/3731

Abstract: A package has a cavity to be sealed by a lid. The package includes a heat sink having a coefficient of thermal expansion of 9 ppm/° C. or more and 15 ppm/° C. or less from 25° C. to 100° C. and a frame disposed on the heat sink, made of ceramics, and surrounding the cavity in plan view. An outer edge of the frame includes a first linear portion extending along a first direction, a second linear portion extending along a second direction orthogonal to the first direction, and a chamfer connecting the first linear portion and the second linear portion in plan view.

公开(公告)号：US11897817B2

公开(公告)日：2024-02-13

申请号：US17317986

申请日：2021-05-12

Applicant: NGK INSULATORS, LTD. ,  NGK ELECTRONICS DEVICES, INC.

Inventor： Yuji Umeda ,  Jyunji Oogami

IPC: C04B37/02 ,  H01L23/373 ,  C04B35/119

CPC classification number: C04B37/021 ,  C04B35/119 ,  H01L23/3735 ,  C04B2235/3201 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3222 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/3418 ,  C04B2235/765 ,  C04B2237/343 ,  C04B2237/402 ,  C04B2237/407

Abstract: In a ceramic sintered body, the Zr content is 17.5 mass %-23.5 mass % in terms of ZrO2, the Hf content is 0.3 mass %-0.5 mass % in terms of HfO2, the Al content is 74.3 mass %-80.9 mass % in terms of Al2O3, the Y content is 0.8 mass %-1.9 mass % in terms of Y2O3, the Mg content is 0.1 mass %-0.8 mass % in terms of MgO, the Si content is 0.1 mass %- and 1.5 mass % in terms of SiO2, and the Ca content is 0.03 mass %-0.35 mass % in terms of CaO. The total content of Na and K is 0.01 mass %-0.10 mass %, when the K content is converted to K2O and the Na content is converted to Na2O. The balance content is 0.05 mass % or less in terms of oxide.

公开(公告)号：US11854934B2

公开(公告)日：2023-12-26

申请号：US17700720

申请日：2022-03-22

Applicant: NGK ELECTRONICS DEVICES, INC. ,  NGK INSULATORS, LTD.

Inventor： Noriyasu Yamamoto ,  Yoshikazu Mihara ,  Naoya Shirai

IPC: H01L23/373 ,  H01L23/367

CPC classification number: H01L23/3735 ,  H01L23/367

Abstract: A heat sink includes first to fifth layers. The first layer supports a frame made of ceramics, is made of copper, and has a thickness t1. The second layer is laminated to the first layer, is made of molybdenum, and has a thickness t2. The third layer is laminated to the second layer, is made of copper, and has a thickness t3. The fourth layer is laminated to the third layer, is made of molybdenum, and has a thickness t4. The fifth layer is laminated to the fourth layer, is made of copper, and has a thickness t5. A formula 3≤t1/t5≤5 is satisfied. A formula 3≤t3/t5≤5 is satisfied.

公开(公告)号：US11849538B2

公开(公告)日：2023-12-19

申请号：US17445738

申请日：2021-08-24

Applicant: NGK Electronics Devices, Inc. ,  NGK Insulators, Ltd. ,  Fujitsu Optical Components Limited

Inventor： Noboru Kubo ,  Masato Ishizaki ,  Kento Takahashi

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  G02B6/42 ,  H05K1/18

CPC classification number: H05K1/0245 ,  G02B6/4281 ,  H05K1/118 ,  H05K1/148 ,  H05K1/18 ,  H05K2201/09236 ,  H05K2201/09481 ,  H05K2201/09672 ,  H05K2201/2018

Abstract: A terminal substrate includes a signal terminal disposed on a terminal surface of an insulation ceramic layer. An insulation resin layer of a flexible substrate includes a first surface facing the terminal surface, and a second surface on an opposite side of the first surface. A first signal pad disposed on the first surface is joined to the signal terminal. A first penetration conductive part penetrates the insulation resin layer from the first signal pad. A first signal line is disposed on the second surface. A second penetration conductive part penetrates the insulation resin layer from the first signal line. A second signal line is disposed on the first surface. A third penetration conductive part penetrates the insulation resin layer from the second signal line. A second signal pad is disposed on the second surface.

公开(公告)号：US20220151060A1

公开(公告)日：2022-05-12

申请号：US17445738

申请日：2021-08-24

Applicant: NGK Electronics Devices, Inc. ,  NGK Insulators, Ltd. ,  Fujitsu Optical Components Limited

Inventor： Noboru KUBO ,  Masato ISHIZAKI ,  Kento TAKAHASHI

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/11 ,  G02B6/42

Abstract: A terminal substrate includes a signal terminal disposed on a terminal surface of an insulation ceramic layer. An insulation resin layer of a flexible substrate includes a first surface facing the terminal surface, and a second surface on an opposite side of the first surface. A first signal pad disposed on the first surface is joined to the signal terminal. A first penetration conductive part penetrates the insulation resin layer from the first signal pad. A first signal line is disposed on the second surface. A second penetration conductive part penetrates the insulation resin layer from the first signal line. A second signal line is disposed on the first surface. A third penetration conductive part penetrates the insulation resin layer from the second signal line. A second signal pad is disposed on the second surface.

公开(公告)号：US20250100925A1

公开(公告)日：2025-03-27

申请号：US18976838

申请日：2024-12-11

Applicant: NGK ELECTRONICS DEVICES, INC. ,  NGK INSULATORS, LTD.

Inventor： Hiroshi KOUNO ,  Atsushi MASE

IPC: C03C10/00

Abstract: Provided is a sintered body containing Al2O3, SiO2, and MnO, the sintered body including: a main crystal phase formed of Al2O3; a first glass phase; and a second glass phase having a composition different from a composition of the first glass phase. The first glass phase and the second glass phase are phases each containing SiO2 and MnO. A content ratio of SiO2 to a sum of SiO2 and MnO in the first glass phase is larger than a content ratio of SiO2 to a sum of SiO2 and MnO in the second glass phase.

公开(公告)号：US11901268B2

公开(公告)日：2024-02-13

申请号：US17455709

申请日：2021-11-19

Applicant: NGK Electronics Devices, Inc. ,  NGK Insulators, Ltd.

Inventor： Yoshio Tsukiyama ,  Teppei Yamaguchi

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L23/66

CPC classification number: H01L23/49568 ,  H01L21/4821 ,  H01L21/4871 ,  H01L23/49562 ,  H01L24/83 ,  H01L23/66 ,  H01L24/46 ,  H01L24/49 ,  H01L24/85

Abstract: An external terminal electrode is attached to a frame, and the frame contains a first resin, and has a first adhered surface. A heat sink plate supports the frame, has an unmounted region where a power semiconductor element is to be mounted within the frame in plan view, is made of metal, and has a second adhered surface. An adhesive layer contains a second resin different from the first resin, and adheres the first adhered surface of the frame and the second adhered surface of the heat sink plate to each other. One of the first and second adhered surfaces includes a flat portion and a protruding portion. The protruding portion protrudes from the flat portion and opposes the other one of the first adhered surface and the second adhered surface with the adhesive layer therebetween.

公开(公告)号：US20220077011A1

公开(公告)日：2022-03-10

申请号：US17455719

申请日：2021-11-19

Applicant: NGK Electronics Devices, Inc. ,  NGK Insulators, Ltd.

Inventor： Yoshio TSUKIYAMA ,  Akiyoshi OSAKADA ,  Teppei YAMAGUCHI

IPC: H01L23/047 ,  H01L23/36 ,  H01L23/495 ,  H01L21/52

Abstract: A first frame is supported by a heat sink plate, surrounds an unmounted region of the heat sink plate, contains a resin, and has a first surface. A second frame contains a resin, and has a second surface opposing the first surface. An external terminal electrode passes between the first surface and the second surface. An adhesive layer contains a resin, and includes a lower portion, an upper portion, and an intermediate portion. The lower portion connects the external terminal electrode and the first surface to each other. The upper portion connects the external terminal electrode and the second surface to each other. The intermediate portion is disposed within a through hole of the external terminal electrode, and connects the lower portion and the upper portion to each other.