Invention Grant
- Patent Title: Stacked channel structures for MOSFETs
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Application No.: US15773325Application Date: 2015-12-03
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Publication No.: US10790281B2Publication Date: 2020-09-29
- Inventor: Rishabh Mehandru , Roza Kotlyar , Stephen M. Cea , Patrick H. Keys
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- International Application: PCT/US2015/063613 WO 20151203
- International Announcement: WO2017/095409 WO 20170608
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8238 ; H01L29/10 ; H01L27/06 ; H01L29/78 ; H01L21/822 ; H01L27/12 ; H01L21/84 ; H01L29/66

Abstract:
Disclosed herein are stacked channel structures for metal oxide semiconductor field effect transistors (MOSFETs) and related circuit elements, computing devices, and methods. For example, a stacked channel structure may include: a semiconductor substrate having a substrate lattice constant; a fin extending away from the semiconductor substrate, the fin having an upper region and a lower region; a first transistor in the lower region, wherein the first transistor has a first channel, the first channel has a first lattice constant, and the first lattice constant is different from the substrate lattice constant; and a second transistor in the upper region, wherein the second transistor has a second channel, the second channel has a second lattice constant, and the second lattice constant is different from the substrate lattice constant.
Public/Granted literature
- US20180323195A1 STACKED CHANNEL STRUCTURES FOR MOSFETS Public/Granted day:2018-11-08
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