Invention Grant
- Patent Title: Packaging system
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Application No.: US15013609Application Date: 2016-02-02
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Publication No.: US10793308B2Publication Date: 2020-10-06
- Inventor: Masatsugu Tanaka , Toshiyuki Sakata
- Applicant: Ishida Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Ishida Co., Ltd.
- Current Assignee: Ishida Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Studebaker & Brackett PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4b5fde9b
- Main IPC: B65B59/00
- IPC: B65B59/00 ; B65B61/26 ; B65B35/56 ; B65B49/08 ; B65B57/14 ; B65B35/20 ; B65B11/54 ; B65B51/16 ; B65B49/02 ; B65B67/10 ; B65B57/04 ; B65B57/10 ; G05B15/02 ; H04L29/08 ; B65B41/16

Abstract:
A packaging system according to an aspect is a packaging system formed by connecting an external server to a plurality of packaging apparatuses via a network. The external server stores control parameters for the packaging apparatuses to package an article to be packaged in an optimal state. The packaging apparatus communicates with the external server, downloads necessary control parameters, and controls a packaging operation by using the downloaded control parameters. Accordingly, a setting operation performed in each of the packaging apparatuses can be significantly reduced.
Public/Granted literature
- US20160229574A1 PACKAGING SYSTEM Public/Granted day:2016-08-11
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