- Patent Title: Semiconductor device package and method of manufacturing the same
-
Application No.: US16152270Application Date: 2018-10-04
-
Publication No.: US10797022B2Publication Date: 2020-10-06
- Inventor: Hsu-Nan Fang , Chun-Jun Zhuang , Yung I. Yeh , Ming-Chiang Lee
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/31 ; H01L23/538 ; H01L23/00 ; H01L21/56 ; H01L21/683 ; H01L23/367 ; H01L21/48 ; H01L23/498
Abstract:
A semiconductor device package includes a first redistribution layer (RDL), a first die, a second die, a second RDL and an encapsulant. The first die is disposed on the first RDL and is electrically connected to the first RDL. The first die has a first electrical contact. The second die is disposed on the first RDL and is electrically connected to the first RDL. The second die has a first electrical contact. The second RDL is surrounded by the first RDL. The second RDL has a first electrical contact electrically connected to the first electrical contact of the first die and a second electrical contact electrically connected to the first electrical contact of the second die. A size of the first electrical contact of the second RDL is greater than a size of the second electrical contact of the second RDL.
Public/Granted literature
- US20190109117A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-04-11
Information query
IPC分类:
