Invention Grant
- Patent Title: Mechanisms for forming image sensor device
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Application No.: US16390990Application Date: 2019-04-22
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Publication No.: US10797094B2Publication Date: 2020-10-06
- Inventor: Volume Chien , Yun-Wei Cheng , Shiu-Ko Jangjian , Zhe-Ju Liu , Kuo-Cheng Lee , Chi-Cherng Jeng
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/0232 ; H01L31/0216

Abstract:
An image sensor device is provided. The image sensor device includes a semiconductor substrate and a light sensing region in the semiconductor substrate. The image sensor device also includes a dielectric layer over the semiconductor substrate. The image sensor device further includes a filter partially surrounded by the dielectric layer. The filter has a protruding portion protruding from a bottom surface of the dielectric layer. In addition, the image sensor device includes a shielding layer between the dielectric layer and the semiconductor substrate and surrounding the protruding portion of the filter.
Public/Granted literature
- US20190252440A1 MECHANISMS FOR FORMING IMAGE SENSOR DEVICE Public/Granted day:2019-08-15
Information query
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