- 专利标题： Packaged electronic circuits having moisture protection encapsulation and methods of forming same
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申请号： US15960693申请日： 2018-04-24
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公开(公告)号： US10811370B2公开(公告)日： 2020-10-20
- 发明人: Kyle Bothe , Dan Namishia , Fabian Radulescu , Scott Sheppard
- 申请人： Cree, Inc.
- 申请人地址： US NC Durham
- 专利权人： Cree, Inc.
- 当前专利权人： Cree, Inc.
- 当前专利权人地址： US NC Durham
- 代理机构： Myers Bigel, P.A.
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/528 ; H01L23/31 ; H01L23/66 ; H01L23/64 ; H01L25/065 ; H01L25/00
摘要：
A packaged electronic circuit includes a substrate having an upper surface, a first metal layer on the upper surface of the substrate, a first polymer layer on the first metal layer opposite the substrate, a second metal layer on the first polymer layer opposite the first metal layer, a dielectric layer on the first polymer layer and at least a portion of the second metal layer and a second polymer layer on the dielectric layer.
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