- 专利标题： Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive material
-
申请号： US16445904申请日： 2019-06-19
-
公开(公告)号： US10813228B2公开(公告)日： 2020-10-20
- 发明人: Lee C. Kresge , Elaina J. Zito , Ning-Cheng Lee
- 申请人： INDIUM CORPORATION
- 申请人地址： US NY Utica
- 专利权人： INDIUM CORPORATION
- 当前专利权人： INDIUM CORPORATION
- 当前专利权人地址： US NY Utica
- 代理机构： Sheppard, Mullin, Richter & Hampton LLP
- 主分类号： H05K3/46
- IPC分类号： H05K3/46 ; H05K1/14 ; H05K3/30 ; H05K1/02 ; H05K1/11 ; H05K1/18 ; H05K3/32 ; H05K3/34 ; H05K3/42
摘要：
Implementations of the disclosure describe techniques for eliminating or reducing hot tearing in via-in-pad plated over (VIPPO) solder joints by incorporating an adhesive into a printed circuit board assembly (PCBA). In an embodiment, the adhesive is an adhesive containing fluxing agent that prevents tearing by reducing a differential in thermal expansion caused by a coefficient of thermal expansion (CTE) mismatch between a plated metal of the VIPPO pads and the PCB substrate.
公开/授权文献
信息查询
