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    High reliability leadfree solder alloys for harsh service conditions
    2.
    发明授权
    High reliability leadfree solder alloys for harsh service conditions 有权

    公开(公告)号：US11752579B2

    公开(公告)日：2023-09-12

    申请号：US16801556

    申请日：2020-02-26

    申请人： INDIUM CORPORATION

    发明人： Jie Geng ,  Hongwen Zhang ,  Ning-Cheng Lee

    IPC分类号： B23K35/26 ,  B23K35/02 ,  H05K1/18 ,  B23K101/42 ,  B23K103/08

    CPC分类号： B23K35/262 ,  B23K35/025 ,  H05K1/181 ,  B23K2101/42 ,  B23K2103/08

    摘要： High reliability leadfree solder alloys for harsh service conditions are disclosed. In some embodiments, a solder alloy comprises 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a component comprising: a main ceramic body, and a side surface having disposed thereon an electrode and a thermal pad; a copper substrate; and a solder alloy electrically coupling the component and the copper substrate, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a light-emitting diode (LED) component; a Metal Core Printed Circuit Board (MCPCB); and a solder alloy electrically coupling the LED component and the MCPCB, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn.

    Fluxes effective in suppressing non-wet-open at BGA assembly
    3.
    发明授权
    Fluxes effective in suppressing non-wet-open at BGA assembly 有权

    公开(公告)号：US10756039B2

    公开(公告)日：2020-08-25

    申请号：US16172822

    申请日：2018-10-28

    申请人： Indium Corporation

    发明人： Fengying Zhou ,  Fen Chen ,  Ning-Cheng Lee

    IPC分类号： H01L21/44 ,  H01L21/56 ,  B23K35/24 ,  H05K3/30 ,  H01L23/498 ,  H01L23/00 ,  H05K3/34

    摘要： The disclosure describes techniques for eliminating or reducing non-wet open (NWO) defect formation by using a low activity flux to prevent a solder paste from sticking to ball grid array (BGA) solder balls during reflow soldering. The low activity flux may be configured such that: i) it creates a barrier that prevents the solder paste from sticking to the solder balls of the BGA; and ii) it does not impede the formation of solder joints during reflow. In implementations, a solid coating of the low activity flux may be formed over balls of the BGA, and the BGA may then be bonded to a PCB during reflow. In implementations, the balls of a BGA may be dipped in a low-activity creamy or liquid flux prior to reflow. In some implementations, the flux may applied on a solder paste printed on pads of the PCB, followed by placement of a BGA.

    SNBI AND SNIN SOLDER ALLOYS
    6.
    发明申请
    SNBI AND SNIN SOLDER ALLOYS 审中-公开

    公开(公告)号：US20200070287A1

    公开(公告)日：2020-03-05

    申请号：US16557587

    申请日：2019-08-30

    申请人： INDIUM CORPORATION

    发明人： Francis M. Mutuku ,  Ning-Cheng Lee ,  Hongwen Zhang

    IPC分类号： B23K35/26 ,  C22C13/02 ,  C22C12/00

    摘要： Some implementations of the disclosure are directed to low melting temperature (e.g., liquidus temperature below 210° C.) SnBi or Snln solder alloys. A SnBi solder alloy may consist of 2 to 60 wt % Bi; optionally, one or more of: up to 16 wt % In, up to 4.5 wt % Ag, up to 2 wt % Cu, up to 12 wt % Sb, up to 2.5 wt % Zn, up to 1.5 wt % Ni, up to 1.5 wt % Co, up to 1.5 wt % Ge, up to 1.5 wt % P, and up to 1.5 wt % Mn; and a remainder of Sn. A Snln solder alloy may consist of: 8 to 20 wt % In; optionally, one or more of: up to 12 wt % Bi, up to 4 wt % Ag, up to 5 wt % Sb, up to 3 wt % Cu, up to 2.5 wt % Zn, up to 1.5 wt % Ni, up to 1.5 wt % Co, up to 1.5 wt % Ge, up to 1.5 wt % P, and up to 1.5 wt % Mn; and a remainder of Sn.

    Mixed alloy solder paste
    7.
    发明授权
    Mixed alloy solder paste 有权

    公开(公告)号：US10118260B2

    公开(公告)日：2018-11-06

    申请号：US14629139

    申请日：2015-02-23

    申请人： Indium Corporation

    发明人： Hongwen Zhang ,  Ning-Cheng Lee

    IPC分类号： B23K35/26 ,  B23K35/02 ,  B23K35/362 ,  H01L23/00 ,  C22C12/00 ,  H05K3/34

    摘要： A solder paste consists of an amount of a first solder alloy powder between 60 wt % to 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C.