Invention Grant
- Patent Title: High reliability lead-free solder alloy
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Application No.: US16098367Application Date: 2017-05-02
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Publication No.: US10821557B2Publication Date: 2020-11-03
- Inventor: Morgana De Avila Ribas , Suresh Telu , Pritha Choudhury , Anil K. N. Kumar , Siuli Sarkar
- Applicant: Alpha Assembly Solutions Inc.
- Applicant Address: US NJ Somerset
- Assignee: Alpha Assembly Solutions Inc.
- Current Assignee: Alpha Assembly Solutions Inc.
- Current Assignee Address: US NJ Somerset
- Agency: Carmody Torrance Sandak & Hennessey LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3347b66d
- International Application: PCT/US2017/030547 WO 20170502
- International Announcement: WO2017/192517 WO 20171109
- Main IPC: B23K1/00
- IPC: B23K1/00 ; B23K35/26 ; C22C13/02

Abstract:
Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150° C., for example up to 175° C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn—Ag—Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.
Public/Granted literature
- US20190389012A1 High Reliability Lead-Free Solder Alloy Public/Granted day:2019-12-26
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