Invention Grant
- Patent Title: Sheet for semiconductor processing
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Application No.: US15764377Application Date: 2016-03-28
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Publication No.: US10825711B2Publication Date: 2020-11-03
- Inventor: Yasuhiko Kakiuchi , Takashi Akutsu , Sayaka Bandou , Yuichiro Komasu
- Applicant: LINTEC CORPORATION
- Applicant Address: JP Itabashi-ku
- Assignee: LINTEC CORPORATION
- Current Assignee: LINTEC CORPORATION
- Current Assignee Address: JP Itabashi-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@c485386
- International Application: PCT/JP2016/059803 WO 20160328
- International Announcement: WO2017/061132 WO 20170413
- Main IPC: H01L21/304
- IPC: H01L21/304 ; C09J133/08 ; C09J133/14 ; C09J7/38 ; C09J7/20 ; C09J7/29 ; B32B27/36 ; B32B27/32 ; C08F220/18 ; C08F220/20 ; H01L21/683 ; C09J153/00 ; C09J133/06 ; C08F293/00
Abstract:
The sheet for semiconductor processing of the present invention includes a base, an unevenness-absorbing layer provided on one surface of the base, and a pressure sensitive adhesive layer provided on the unevenness-absorbing layer, wherein the pressure sensitive adhesive layer is composed of an energy ray-curable pressure sensitive adhesive, and a stress at rupture of the pressure sensitive adhesive layer after energy ray curing is 10 MPa or more.
Public/Granted literature
- US20180286736A1 SHEET FOR SEMICONDUCTOR PROCESSING Public/Granted day:2018-10-04
Information query
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