- Patent Title: Low inductance electrical contact assembly manufacturing process
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Application No.: US16115322Application Date: 2018-08-28
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Publication No.: US10830812B2Publication Date: 2020-11-10
- Inventor: Wei Kuong Foong , Kok Sing Goh , Shamal Mundiyath , Eng Kiat Lee
- Applicant: JF MICROTECHNOLOGY SDN. BHD.
- Applicant Address: MY Petaling Jaya
- Assignee: JF MICROTECHNOLOGY SDN. BHD.
- Current Assignee: JF MICROTECHNOLOGY SDN. BHD.
- Current Assignee Address: MY Petaling Jaya
- Agency: Maschoff Brennan
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@30e3538c
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H01R13/405 ; H01R13/6461 ; H01R43/20 ; H01R43/24 ; G01R1/067 ; G01R1/073 ; H01R13/24 ; H01R13/504 ; H01R13/506

Abstract:
A manufacturing process for an electrical contact assembly that uses an assembly jig with a middle horizontal lip adapted to fit into a plurality of C-shaped inner contact pins, as well as top and bottom guide teeth that guide top and bottom parts of the inner pins as they are being assembled. An inner holder then covers the inner pins, at which point epoxy is applied, which when cured, secures the inner holder to the plurality of inner pins. Outer contact pins in turn cover the outside of the inner holder, and an outer holder covers the outer contact pins. Epoxy is also applied between the outer holder and outer pins, which when cured, secures the outer holder to the plurality of outer pins. A heat curing process is also employed to assist with the curing of the epoxy, during which a clamp temporarily holds the assembly in place.
Public/Granted literature
- US20190064260A1 LOW INDUCTANCE ELECTRICAL CONTACT ASSEMBLY MANUFACTURING PROCESS Public/Granted day:2019-02-28
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