Invention Grant
- Patent Title: Managing thermal warpage of a laminate
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Application No.: US15934972Application Date: 2018-03-24
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Publication No.: US10832987B2Publication Date: 2020-11-10
- Inventor: Charles L. Arvin , Marcus E. Interrante , Thomas E. Lombardi , Hilton T. Toy , Krishna R. Tunga , Thomas Weiss
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Law Offices of Ira D. Blecker, P.C.
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H05K1/02 ; H01L23/42 ; H01L23/538 ; H01L23/00

Abstract:
A method of managing thermal warpage of a laminate which includes: assembling a stiffener and an adhesive on the laminate, the stiffener being a material that has a higher modulus of elasticity than the laminate; applying a force to deform the laminate a predetermined amount; heating the laminate, stiffener and adhesive to a predetermined temperature at which the adhesive cures to bond the stiffener to the laminate; cooling the laminate, stiffener and adhesive to a temperature below the predetermined temperature, the laminate maintaining its deformed shape.
Public/Granted literature
- US20190295921A1 MANAGING THERMAL WARPAGE OF A LAMINATE Public/Granted day:2019-09-26
Information query
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