- Patent Title: Nanowire enabled substrate bonding and electrical contact formation
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Application No.: US15950239Application Date: 2018-04-11
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Publication No.: US10833048B2Publication Date: 2020-11-10
- Inventor: Li-Wen Hung , Reinaldo Vega , Hari Mallela
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Main IPC: H01L23/00
- IPC: H01L23/00

Abstract:
A technique relates to a semiconductor device. First nanowires are formed on a first substrate, the first nanowires being electrically coupled to one or more first electrical sites on the first substrate. Second nanowires are formed on a second substrate, the second nanowires being electrically coupled to one or more second electrical sites on the second substrate. The first nanowires and the second nanowires are electrically coupled such that the one or more first electrical sites are electrically coupled to the one or more second electrical sites.
Public/Granted literature
- US20190319006A1 NANOWIRE ENABLED SUBSTRATE BONDING AND ELECTRICAL CONTACT FORMATION Public/Granted day:2019-10-17
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