Invention Grant
- Patent Title: Electrostatic chuck, substrate processing apparatus, and method of manufacturing semiconductor device using the same
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Application No.: US16703270Application Date: 2019-12-04
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Publication No.: US10854485B2Publication Date: 2020-12-01
- Inventor: Minsung Kim , Myoung Soo Park , Dongyun Yeo , Dougyong Sung , Suho Lee , Yun-Kwang Jeon
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2017-0085015 20170704
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/683 ; H01L21/3065 ; H01L21/311 ; H02N13/00 ; H01J37/32 ; H01L21/324 ; H01L21/3213
Abstract:
An electrostatic chuck, a substrate processing apparatus, and a method of manufacturing a semiconductor device are provided. The electrostatic chuck comprises a chuck base, an insulation plate on the chuck base, a first heater comprising a cell heater in the insulation plate, and a heater controller configured to control the cell heater. The heater controller obtains a resistance of the cell heater and compares the resistance with a threshold value to control a heating power provided to the cell heater.
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