公开(公告)号：US20210159112A1

公开(公告)日：2021-05-27

申请号：US16895513

申请日：2020-06-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeongsang Kim ,  Keonwoo Kim ,  Wooram Kim ,  Eungsu Kim ,  Heewon Min ,  Sangwook Park ,  Seungwon Shin ,  Dongyun Yeo ,  Geunsik Oh ,  Hyanjung Lee

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/683 ,  H01J37/20

Abstract: A lift apparatus for moving an object up and down in a substrate processing apparatus, the lift apparatus including a body configured to support the object while a lift hole, included in the body, is overlapped by the object in a vertical direction; a lift pin configured to move the object up and down by moving up and down in the lift hole; a bellows including an upper flange, a lower flange, and a flexible pipe; a connector combined with a lower portion of the lift pin in the flexible pipe and configured to interfere with downward movement of the lift pin and to allow at least one from among rotation, sliding, and tilting of the lift pin; a load sensor configured to measure vertical load generated in accordance with movement of the lift pin; and an actuator configured to move the lift pin up and down.

公开(公告)号：US20240162014A1

公开(公告)日：2024-05-16

申请号：US18383211

申请日：2023-10-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heewon Min ,  Dongyun Yeo ,  Songyun Kang ,  Juho Kim ,  Seungbin Lim

IPC: H01J37/32

CPC classification number: H01J37/32513 ,  H01J2237/166 ,  H01J2237/24507

Abstract: A process chamber includes a housing providing a process space where plasma processing is performed, a first opening/closing device in a side wall of the housing, the first opening/closing device including a first frame and at least one opening/closing blade connected to the first frame, and a second opening/closing device on an outside of the side wall of the housing and on a same line as the first opening/closing device, the second opening/closing device including a second frame and an opening/closing door structure connected to the second frame, wherein the first opening/closing device and the second opening/closing device are configured to maintain a vacuum state of the process space.

公开(公告)号：US10854485B2

公开(公告)日：2020-12-01

申请号：US16703270

申请日：2019-12-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minsung Kim ,  Myoung Soo Park ,  Dongyun Yeo ,  Dougyong Sung ,  Suho Lee ,  Yun-Kwang Jeon

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/3065 ,  H01L21/311 ,  H02N13/00 ,  H01J37/32 ,  H01L21/324 ,  H01L21/3213

Abstract: An electrostatic chuck, a substrate processing apparatus, and a method of manufacturing a semiconductor device are provided. The electrostatic chuck comprises a chuck base, an insulation plate on the chuck base, a first heater comprising a cell heater in the insulation plate, and a heater controller configured to control the cell heater. The heater controller obtains a resistance of the cell heater and compares the resistance with a threshold value to control a heating power provided to the cell heater.

公开(公告)号：US11984344B2

公开(公告)日：2024-05-14

申请号：US16895513

申请日：2020-06-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeongsang Kim ,  Keonwoo Kim ,  Wooram Kim ,  Eungsu Kim ,  Heewon Min ,  Sangwook Park ,  Seungwon Shin ,  Dongyun Yeo ,  Geunsik Oh ,  Hyanjung Lee

IPC: H01L21/687 ,  H01J37/20 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/68742 ,  H01J37/20 ,  H01L21/67242 ,  H01L21/6831 ,  H01J2237/334

Abstract: A lift apparatus for moving an object up and down in a substrate processing apparatus, the lift apparatus including a body configured to support the object while a lift hole, included in the body, is overlapped by the object in a vertical direction; a lift pin configured to move the object up and down by moving up and down in the lift hole; a bellows including an upper flange, a lower flange, and a flexible pipe; a connector combined with a lower portion of the lift pin in the flexible pipe and configured to interfere with downward movement of the lift pin and to allow at least one from among rotation, sliding, and tilting of the lift pin; a load sensor configured to measure vertical load generated in accordance with movement of the lift pin; and an actuator configured to move the lift pin up and down.

公开(公告)号：US10522374B2

公开(公告)日：2019-12-31

申请号：US15857047

申请日：2017-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minsung Kim ,  Myoung Soo Park ,  Dongyun Yeo ,  Dougyong Sung ,  Suho Lee ,  Yun-Kwang Jeon

IPC: H01L21/67 ,  H01L21/683 ,  H01J37/32 ,  H02N13/00 ,  H01L21/3065 ,  H01L21/324 ,  H01L21/311 ,  H01L21/3213

Abstract: An electrostatic chuck, a substrate processing apparatus, and a method of manufacturing a semiconductor device are provided. The electrostatic chuck comprises a chuck base, an insulation plate on the chuck base, a first heater comprising a cell heater in the insulation plate, and a heater controller configured to control the cell heater. The heater controller obtains a resistance of the cell heater and compares the resistance with a threshold value to control a heating power provided to the cell heater.

公开(公告)号：US20190013222A1

公开(公告)日：2019-01-10

申请号：US15857047

申请日：2017-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minsung Kim ,  Myoung Soo Park ,  Dongyun Yeo ,  Dougyong Sung ,  Suho Lee ,  Yun-Kwang Jeon

IPC: H01L21/67 ,  H02N13/00 ,  H01L21/683 ,  H01L21/324 ,  H01L21/3065 ,  H01J37/32

CPC classification number: H01L21/67248 ,  H01J37/321 ,  H01J37/32724 ,  H01J37/32733 ,  H01J2237/334 ,  H01L21/3065 ,  H01L21/31116 ,  H01L21/32137 ,  H01L21/324 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/6833 ,  H02N13/00

Abstract: An electrostatic chuck, a substrate processing apparatus, and a method of manufacturing a semiconductor device are provided. The electrostatic chuck comprises a chuck base, an insulation plate on the chuck base, a first heater comprising a cell heater in the insulation plate, and a heater controller configured to control the cell heater. The heater controller obtains a resistance of the cell heater and compares the resistance with a threshold value to control a heating power provided to the cell heater.