- Patent Title: Inter-die passive interconnects approaching monolithic performance
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Application No.: US16236136Application Date: 2018-12-28
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Publication No.: US10854548B2Publication Date: 2020-12-01
- Inventor: Zuoguo Wu , Debendra Das Sharma , Adel A. Elsherbini , Gerald Pasdast
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L25/00 ; H01L23/00 ; H01L25/065
Abstract:
Inter-die passive interconnects are lengthened while locating I/O circuitry away from die edge, such that passive interconnect length is agglomerated toward the die edge, and inter-die communication is expedited.
Public/Granted literature
- US20200211965A1 INTER-DIE PASSIVE INTERCONNECTS APPROACHING MONOLITHIC PERFORMANCE Public/Granted day:2020-07-02
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