- 专利标题: Substrate transfer device
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申请号: US16467303申请日: 2016-12-15
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公开(公告)号: US10856458B2公开(公告)日: 2020-12-01
- 发明人: Ritsuo Hirukawa , Takeshi Kondo , Shoji Fukakusa , Mitsuaki Kato , Atsushi Torii , Jun Iisaka
- 申请人: FUJI CORPORATION
- 申请人地址: JP Chiryu
- 专利权人: FUJI CORPORATION
- 当前专利权人: FUJI CORPORATION
- 当前专利权人地址: JP Chiryu
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 国际申请: PCT/JP2016/087355 WO 20161215
- 国际公布: WO2018/109891 WO 20180621
- 主分类号: H05K13/00
- IPC分类号: H05K13/00 ; H05K3/34 ; H05K13/02 ; H05K13/04 ; B65G15/12 ; B65G15/24
摘要:
A first conveyor belt and second conveyor belt are disposed on guide rail which is disposed so as to extend in a circuit substrate conveyance direction. Then, the circuit substrate supported by both the conveyor belts of the first conveyor belt and the second conveyor belt is held by substrate holding device, and work is performed on the held circuit substrate. In the transfer device having such a structure, for example, when the circuit substrate on which an operation has been completed is conveyed out by the second conveyor belt, a new circuit substrate is conveyed into the transfer device by the first conveyor belt. In this way, it is possible to perform printing work on a new circuit substrate at an early stage and shorten a cycle time.
公开/授权文献
- US20200077548A1 SUBSTRATE TRANSFER DEVICE 公开/授权日:2020-03-05
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