公开(公告)号：US10906295B2

公开(公告)日：2021-02-02

申请号：US16464974

申请日：2016-12-05

申请人： FUJI CORPORATION

发明人： Yoshimune Yokoi ,  Ritsuo Hirukawa ,  Shoji Fukakusa ,  Naoki Matsuzaki

IPC分类号： B41F35/00 ,  B41F15/12 ,  B41F15/36 ,  B41F15/44 ,  H05K3/12 ,  B41F15/08

摘要： A printing apparatus including: a cleaning section including a cleaning member and configured to perform cleaning processing of a screen mask used in printing of a viscous fluid onto a print target; a cleaning member moving section configured to perform at least one of moving the cleaning member to and from a cleaning position and an exchange position, and unloading and loading of the cleaning member; and an exchange control section configured to control the cleaning member moving section to perform cleaning member exchange processing of exchanging the cleaning member.

公开(公告)号：US11148411B2

公开(公告)日：2021-10-19

申请号：US16305759

申请日：2016-06-17

申请人： FUJI CORPORATION

发明人： Minoru Kinuta ,  Shoji Fukakusa ,  Kento Asaoka

IPC分类号： B41F15/46 ,  B41M1/12 ,  B41F15/08 ,  B41F15/42 ,  H05K3/12 ,  B41M3/00 ,  H05K3/34

摘要： A solder paste printer for which a pressing force of squeegee towards a stencil when spreading solder paste is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.

公开(公告)号：US11084278B2

公开(公告)日：2021-08-10

申请号：US16462376

申请日：2016-11-24

申请人： FUJI CORPORATION

发明人： Shoji Fukakusa ,  Takeshi Kondo

IPC分类号： B41F15/44

摘要： An object is to provide a screen printing machine capable of one-way printing on multiple boards. Solder collecting device includes collecting plate moving device, collecting plate, and scraper. Second slider of collecting plate moving device is movable in a front-rear direction along a second guide rail, and is also movable in an up-down direction. Collecting plate is placed on second slider. After squeegee passes by the tail end of printing region of mask, collecting plate is disposed so as to be positioned rearward of squeegee and collects the cream solder moved by the rearward movement of squeegee. Scraper is attached to collecting plate to be movable in a left-right direction and collects the cream solder remaining on mask.

公开(公告)号：US11207879B2

公开(公告)日：2021-12-28

申请号：US16077977

申请日：2016-02-24

申请人： FUJI CORPORATION

发明人： Ritsuo Hirukawa ,  Yoji Fujita ,  Takeshi Kondo ,  Shoji Fukakusa ,  Yoshimune Yokoi ,  Naoki Matsuzaki

IPC分类号： B41F15/44 ,  B41F15/26

摘要： There is provided a screen printer including: a squeegee device for spreading a cream solder over a mask having formed thereon a printing pattern configured of a plurality of through holes to force the cream solder through the printing pattern; a clamping device for holding a board that is conveyed to be placed under the mask; and a lift device for disposing the board with respect to the mask in relation to a vertical direction, wherein the clamping device includes a pair of clamping portions for holding the board therebetween from a width direction, wherein the pair of clamping portions includes individually detachable clamping members that are brought into abutment with lateral end faces of the board, and wherein the clamping members individually have two or more clamping surfaces that are brought into abutment with the board in such a way that the clamping surfaces can be converted.

公开(公告)号：US10856458B2

公开(公告)日：2020-12-01

申请号：US16467303

申请日：2016-12-15

申请人： FUJI CORPORATION

发明人： Ritsuo Hirukawa ,  Takeshi Kondo ,  Shoji Fukakusa ,  Mitsuaki Kato ,  Atsushi Torii ,  Jun Iisaka

IPC分类号： H05K13/00 ,  H05K3/34 ,  H05K13/02 ,  H05K13/04 ,  B65G15/12 ,  B65G15/24

摘要： A first conveyor belt and second conveyor belt are disposed on guide rail which is disposed so as to extend in a circuit substrate conveyance direction. Then, the circuit substrate supported by both the conveyor belts of the first conveyor belt and the second conveyor belt is held by substrate holding device, and work is performed on the held circuit substrate. In the transfer device having such a structure, for example, when the circuit substrate on which an operation has been completed is conveyed out by the second conveyor belt, a new circuit substrate is conveyed into the transfer device by the first conveyor belt. In this way, it is possible to perform printing work on a new circuit substrate at an early stage and shorten a cycle time.

公开(公告)号：US11331901B2

公开(公告)日：2022-05-17

申请号：US16465219

申请日：2016-12-05

申请人： FUJI CORPORATION

发明人： Shoji Fukakusa ,  Ritsuo Hirukawa ,  Yoshimune Yokoi ,  Naoki Matsuzaki

IPC分类号： B41F15/44 ,  B41F15/08 ,  B41F15/42 ,  H05K3/34

摘要： A printing apparatus including: a squeegee fixing section configured to switch to and from a fixed state in which a squeegee used to print a viscous fluid onto a print target is fixed and a released state in which the squeegee is not fixed; and a squeegee moving section configured to move the squeegee fixed by the squeegee fixing section above a screen mask during printing by moving the squeegee fixing section.

公开(公告)号：US10722964B2

公开(公告)日：2020-07-28

申请号：US16085867

申请日：2016-03-18

申请人： FUJI CORPORATION

发明人： Shoji Fukakusa ,  Kento Asaoka

IPC分类号： B23K3/00 ,  B23K3/06 ,  H05K3/12 ,  B05C5/00 ,  B05C11/10 ,  G01F22/02 ,  B05C11/02 ,  H05K3/34 ,  B05C3/18 ,  B23K101/42

摘要： In solder printer, solder supply device uses positive and negative pressure supply device to apply pressure inside air chamber to move solder cup inside outer tube, such that solder paste is supplied from supply nozzle. Controller, when supply of solder paste from supply nozzle is stopped, performs drive control of positive and negative pressure supply device to decrease the pressure inside air chamber, and uses timer to measure the time required from the starting of decreasing the pressure inside the air chamber to when the pressure inside air chamber has reached a set pressure. Because this required time corresponds to the movement amount of solder cup from the start of supply of the solder paste to when supply is stopped, controller using the measured required to estimate the remaining amount of the solder paste in detail with good accuracy.