- Patent Title: Wire bond clamp design and lead frame capable of engaging with same
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Application No.: US15856346Application Date: 2017-12-28
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Publication No.: US10861777B2Publication Date: 2020-12-08
- Inventor: Yuh-Harng Chien , Hung-Yu Chou , Fu-Kang Lee
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/544 ; H01L23/00 ; H01L25/065
Abstract:
Aspects of the disclosure relate generally to semiconductor packaging, and specifically to semiconductor device having a lead frame having a semiconductor supporting die pad that is capable of engaging with a wire bonding clamp.
Public/Granted literature
- US20190206769A1 WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME Public/Granted day:2019-07-04
Information query
IPC分类:
