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公开(公告)号：US10429174B2
公开(公告)日：2019-10-01
申请号：US15848157
申请日：2017-12-20
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Hung-Yu Chou , Chien-Hao Wang , Tse-Tsun Chiu , Fu-Kang Lee , Liang-Kang Su
Abstract: A method for evaluating a leadframe surface includes positioning a leadframe on a measurement apparatus at a first predetermined distance relative to an end portion of a light source of an optical sensor; irradiating a predetermined area on a surface of the leadframe with light having a single predetermined wavelength from the light source; receiving, with a light receiver of the optical sensor, reflected light from the predetermined area on the surface of the leadframe, and converting the reflected light into an electric signal; determining a reflection intensity value of the predetermined area on the surface of the leadframe based on the electric signal; and calculating a reflection ratio of the predetermined area on the surface of the leadframe based on the reflection intensity value and a predetermined reference reflection intensity value associated with the light source.
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公开(公告)号：US10861777B2
公开(公告)日：2020-12-08
申请号：US15856346
申请日：2017-12-28
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Yuh-Harng Chien , Hung-Yu Chou , Fu-Kang Lee
IPC: H01L23/495 , H01L23/544 , H01L23/00 , H01L25/065
Abstract: Aspects of the disclosure relate generally to semiconductor packaging, and specifically to semiconductor device having a lead frame having a semiconductor supporting die pad that is capable of engaging with a wire bonding clamp.
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Patent Agency Ranking
公开(公告)号：US10957631B2
公开(公告)日：2021-03-23
申请号：US16218102
申请日：2018-12-12
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Chung-Ming Cheng , Yuh-Harng Chien , Fu-Kang Lee , Chia-Yu Chang
IPC: H01L23/495 , H01L21/56 , H01L23/00 , H01L23/28 , H01L21/48
Abstract: A leadframe comprising a plurality of leads, each of the plurality of leads having a proximal end and a distal end opposite the proximal end, the distal ends positioned along a linear axis. The leadframe further comprises a die pad closer to the proximal ends than the distal ends of the plurality of leads and including an edge positioned along a plane that intersects the linear axis at an angle less than 90 degrees.
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公开(公告)号：US11421981B2
公开(公告)日：2022-08-23
申请号：US16566140
申请日：2019-09-10
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Hung-Yu Chou , Chien-Hao Wang , Tse-Tsun Chiu , Fu-Kang Lee , Liang-Kang Su
Abstract: A method for evaluating a leadframe surface includes positioning a leadframe on a measurement apparatus at a first predetermined distance relative to an end portion of a light source of an optical sensor; irradiating a predetermined area on a surface of the leadframe with light having a single predetermined wavelength from the light source; receiving, with a light receiver of the optical sensor, reflected light from the predetermined area on the surface of the leadframe, and converting the reflected light into an electric signal; determining a reflection intensity value of the predetermined area on the surface of the leadframe based on the electric signal; and calculating a reflection ratio of the predetermined area on the surface of the leadframe based on the reflection intensity value and a predetermined reference reflection intensity value associated with the light source.
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公开(公告)号：US12040197B2
公开(公告)日：2024-07-16
申请号：US17401057
申请日：2021-08-12
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Yuh-Harng Chien , Hung-Yu Chou , Fu-Kang Lee , Steven Alfred Kummerl
IPC: H01L23/62 , H01L21/48 , H01L23/00 , H01L23/495
CPC classification number: H01L21/4825 , H01L21/4842 , H01L23/49517 , H01L23/49548 , H01L23/62 , H01L24/00 , H01L23/49551 , H01L23/49562
Abstract: An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.
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公开(公告)号：US20200003548A1
公开(公告)日：2020-01-02
申请号：US16566140
申请日：2019-09-10
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Hung-Yu Chou , Chien-Hao Wang , Tse-Tsun Chiu , Fu-Kang Lee , Liang-Kang Su
Abstract: A method for evaluating a leadframe surface includes positioning a leadframe on a measurement apparatus at a first predetermined distance relative to an end portion of a light source of an optical sensor; irradiating a predetermined area on a surface of the leadframe with light having a single predetermined wavelength from the light source; receiving, with a light receiver of the optical sensor, reflected light from the predetermined area on the surface of the leadframe, and converting the reflected light into an electric signal; determining a reflection intensity value of the predetermined area on the surface of the leadframe based on the electric signal; and calculating a reflection ratio of the predetermined area on the surface of the leadframe based on the reflection intensity value and a predetermined reference reflection intensity value associated with the light source.
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公开(公告)号：US10340152B1
公开(公告)日：2019-07-02
申请号：US15857988
申请日：2017-12-29
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Yuh-Harng Chien , Hung-Yu Chou , Fu-Kang Lee , Steven Alfred Kummerl
IPC: H01L23/495 , H01L21/48
CPC classification number: H01L21/4825 , H01L21/4842 , H01L23/49517 , H01L23/49548
Abstract: An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.
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