Barrier film for electronic devices and substrates
Abstract:
Methods for forming a coating over a surface are disclosed. A method includes directing a first source of barrier film material toward a substrate in a first direction at an angle θ relative to the substrate, wherein θ is greater than about 0° and less than about 85°. Additionally, a method of depositing a barrier film over a substrate includes directing a plurality of N sources of barrier film material toward a substrate, each source being directed at an angle θN relative to the substrate, wherein for each θN, θ is greater than about 0° and less than about 180°. For at least a first of the θN, θN is greater than about 0° and less than about 85°, and for at least a second of the θN, θN is greater than about 95° and less than about 180°.
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