Barrier film for electronic devices and substrates

    公开(公告)号:US10862073B2

    公开(公告)日:2020-12-08

    申请号:US14018449

    申请日:2013-09-05

    IPC分类号: H01L51/56 H01L51/52 H01L51/00

    摘要: Methods for forming a coating over a surface are disclosed. A method includes directing a first source of barrier film material toward a substrate in a first direction at an angle θ relative to the substrate, wherein θ is greater than about 0° and less than about 85°. Additionally, a method of depositing a barrier film over a substrate includes directing a plurality of N sources of barrier film material toward a substrate, each source being directed at an angle θN relative to the substrate, wherein for each θN, θ is greater than about 0° and less than about 180°. For at least a first of the θN, θN is greater than about 0° and less than about 85°, and for at least a second of the θN, θN is greater than about 95° and less than about 180°.

    BARRIER FILM FOR ELECTRONIC DEVICES AND SUBSTRATES
    5.
    发明申请
    BARRIER FILM FOR ELECTRONIC DEVICES AND SUBSTRATES 审中-公开
    用于电子设备和基板的遮蔽膜

    公开(公告)号:US20140087497A1

    公开(公告)日:2014-03-27

    申请号:US14018449

    申请日:2013-09-05

    IPC分类号: H01L51/56

    摘要: Methods for forming a coating over a surface are disclosed. A method includes directing a first source of barrier film material toward a substrate in a first direction at an angle θ relative to the substrate, wherein θ is greater than about 0° and less than about 85°. Additionally, a method of depositing a barrier film over a substrate includes directing a plurality of N sources of barrier film material toward a substrate, each source being directed at an angle θN relative to the substrate, wherein for each θN, θ is greater than about 0° and less than about 180°. For at least a first of the θN, θN is greater than about 0° and less than about 85°, and for at least a second of the θN, θN is greater than about 95° and less than about 180°.

    摘要翻译: 公开了在表面上形成涂层的方法。 一种方法包括以第一方向以角度将第一阻挡膜材料源朝向衬底引导; 相对于基底,其中& 大于约0°且小于约85°。 另外,在衬底上沉积阻挡膜的方法包括将多个N源的阻挡膜材料引导向衬底,每个源相对于衬底以一定角度N指向;其中对于每个衬底,N, ; 大于约0°且小于约180°。 对于至少第一个“N”和“N”,N大于约0°且小于约85°,并且对于至少一秒的“N”和“N”,N大于约95°或更小 比约180°。

    BARRIER FILM FOR ELECTRONIC DEVICES AND SUBSTRATES

    公开(公告)号:US20210066675A1

    公开(公告)日:2021-03-04

    申请号:US17090930

    申请日:2020-11-06

    IPC分类号: H01L51/56 H01L51/52

    摘要: Methods for forming a coating over a surface are disclosed. A method includes directing a first source of barrier film material toward a substrate in a first direction at an angle θ relative to the substrate, wherein θ is greater than about 0° and less than about 85°. Additionally, a method of depositing a barrier film over a substrate includes directing a plurality of N sources of barrier film material toward a substrate, each source being directed at an angle θN relative to the substrate, wherein for each θN, θ is greater than about 0° and less than about 180°. For at least a first of the θN, θN is greater than about 0° and less than about 85°, and for at least a second of the θN, θN is greater than about 95° and less than about 180°.

    ELECTRONIC DEVICES WITH IMPROVED SHELF LIVES
    10.
    发明申请
    ELECTRONIC DEVICES WITH IMPROVED SHELF LIVES 有权
    具有改进的生活的电子设备

    公开(公告)号:US20130334510A1

    公开(公告)日:2013-12-19

    申请号:US13917137

    申请日:2013-06-13

    IPC分类号: H01L51/52

    摘要: Embodiments of the present invention provide electronic devices such as OLEDs that have enhanced mechanical integrity and prolonged shelf, by minimizing the spread of a delamination region using topographical non-uniformities introduced in the device structure. For example, a device may be made deliberately non-planar by introducing multiple energy barriers which can prevent or minimize the propagation of a delamination, because the delamination will have to cross the energy barriers in order to spread to a larger area.

    摘要翻译: 本发明的实施例通过使用在设备结构中引入的形貌不均匀性最小化分层区域的扩展来提供诸如具有增强的机械完整性和延长搁架的OLED的电子器件。 例如,通过引入可以防止或最小化分层的传播的多个能量屏障,可以有意地制造非平面装置,因为分层必须穿过能量屏障以扩散到更大的区域。