Invention Grant
- Patent Title: Random forest model for prediction of chip layout attributes
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Application No.: US16557945Application Date: 2019-08-30
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Publication No.: US10885259B2Publication Date: 2021-01-05
- Inventor: Bikram Baidya , John A. Swanson , Kumara Sastry , Prasad N. Atkar , Vivek K. Singh
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alliance IP, LLC
- Main IPC: G06F30/00
- IPC: G06F30/00 ; G06F30/398 ; G06F17/18 ; G06N5/02 ; G06K9/62 ; G06F30/392 ; G06N20/00

Abstract:
An improved random forest model is provided, which has been trained based on silicon data generated from tests of previously fabricated chips. An input is provided to the random forest model, the input including a feature set of a pattern within a particular chip layout, the feature set identifying geometric attributes of polygonal elements within the pattern. A result is generated by the random forest model based on the input, where the result identifies a predicted attribute of the pattern based on the silicon data, and the result is generated based at least in part on determining, within the random forest model, that geometric attributes of the pattern were included in the previously fabricated chips, where the previously fabricated chips have chip layouts are different from the particular chip layout.
Public/Granted literature
- US20200004921A1 RANDOM FOREST MODEL FOR PREDICTION OF CHIP LAYOUT ATTRIBUTES Public/Granted day:2020-01-02
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