Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
-
Application No.: US16183945Application Date: 2018-11-08
-
Publication No.: US10886135B2Publication Date: 2021-01-05
- Inventor: Shinji Kubota , Kazuya Nagaseki , Akihiro Yokota , Gen Tamamushi
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2017-217120 20171110
- Main IPC: H01L21/3065
- IPC: H01L21/3065 ; H01L21/67 ; H01J37/32 ; H01L21/311

Abstract:
In a substrate processing method, electrons having a first energy are supplied from an electron beam generator into an inner space of a chamber body of a substrate processing apparatus to generate negative ions by attaching the electrons to molecules in a processing gas supplied to the inner space. Then a positive bias voltage is applied to an electrode of a supporting table that supports a substrate mounted on thereon in the inner space to attract the negative ions to the substrate.
Public/Granted literature
- US20190148155A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2019-05-16
Information query
IPC分类: