Invention Grant
- Patent Title: Semiconductor device having buried gate structure and method of fabricating the same
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Application No.: US16288910Application Date: 2019-02-28
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Publication No.: US10886375B2Publication Date: 2021-01-05
- Inventor: Dongjin Lee , Junsoo Kim , Moonyoung Jeong , Satoru Yamada , Dongsoo Woo , Jiyoung Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2015-0021726 20150212
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/423 ; H01L27/108 ; H01L21/84 ; H01L29/775 ; H01L29/786 ; H01L27/12 ; H01L29/66 ; B82Y10/00 ; H01L27/088

Abstract:
A semiconductor device may include a device isolation region configured to define an active region in a substrate, an active gate structure disposed in the active region, and a field gate structure disposed in the device isolation region. The field gate structure may include a gate conductive layer. The active gate structure may include an upper active gate structure including a gate conductive layer and a lower active gate structure formed under the upper active gate structure and vertically spaced apart from the upper active gate structure. The lower active gate structure may include a gate conductive layer. A top surface of the gate conductive layer of the field gate structure is located at a lower level than a bottom surface of the gate conductive layer of the upper active gate structure.
Public/Granted literature
- US20190198626A1 SEMICONDUCTOR DEVICE HAVING BURIED GATE STRUCTURE AND METHOD OF FABRICATING THE SAME Public/Granted day:2019-06-27
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