Invention Grant
- Patent Title: Method of manufacturing light emitting module
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Application No.: US16454906Application Date: 2019-06-27
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Publication No.: US10892255B2Publication Date: 2021-01-12
- Inventor: So Sakamaki , Yasunori Nagahama , Masahiko Sano , Katsuyoshi Kadan
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Global IP Counselors, LLP
- Priority: JP2018-123939 20180629
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L33/50 ; H01L33/62 ; H01L33/60 ; H01L33/00

Abstract:
A method of manufacturing a light emitting module including a substrate; a light emitting element having an electrode formation surface comprising a positive and negative pair of element electrodes, and a light emitting surface on the side opposite to the electrode formation surface; a wiring electrode connected to the element electrode; and a light reflective resin layer, the method of manufacturing a light emitting module including: placing the light emitting element on a support member, in a state with the electrode formation surface facing upward, and the light emitting surface facing downward; forming a coating layer on the support member, surrounding the light emitting element; forming the wiring electrode extending from the element electrode over the coating layer; forming the light reflective resin layer on the wiring electrode and the coating layer; joining the substrate on top of the light reflective resin layer; removing the support member; and removing the coating layer.
Public/Granted literature
- US20200006296A1 METHOD OF MANUFACTURING LIGHT EMITTING MODULE Public/Granted day:2020-01-02
Information query
IPC分类: