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42 条记录 (耗时 0.021 秒)

    Fluorescent module and illumination device
    1.
    发明授权
    Fluorescent module and illumination device 有权

    公开(公告)号：US11131433B2

    公开(公告)日：2021-09-28

    申请号：US16536005

    申请日：2019-08-08

    申请人： NICHIA CORPORATION

    发明人： Takafumi Sugiyama ,  Toshiyuki Hirai ,  Masahiko Sano ,  Toru Takasone

    IPC分类号： F21K9/64 ,  F21V29/505 ,  F21V9/30 ,  F21V9/08 ,  F21Y115/30

    摘要： A fluorescent module includes a fluorescent member, a heat dissipation member, and an optical relaxation member. The fluorescent member includes a phosphor-containing layer, and a light reflecting layer. The fluorescent member is secured to the heat dissipation member so that the light reflecting layer is arranged between the phosphor-contacting layer and the heat dissipation member. The optical relaxation member is configured to absorb and/or diffuse light. The optical relaxation member is arranged with respect to the fluorescent member so that the light reflecting layer is arranged between the phosphor-containing layer and the optical relaxation member.

    DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
    2.
    发明申请
    DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE 审中-公开

    公开(公告)号：US20200266326A1

    公开(公告)日：2020-08-20

    申请号：US16796221

    申请日：2020-02-20

    申请人： Nichia Corporation

    发明人： Kinya Ichikawa ,  Katsuyoshi Kadan ,  Masahiko Sano ,  Ryohei Hirose ,  Hiroshi Yoneda

    IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L33/38

    摘要： A method of manufacturing a display device 1 includes: providing a substrate including sub-pixel defined therein and a first wiring disposed for the sub-pixel, and light-emitting element having a lower surface and a lateral surface and including a first electrode disposed on the lower surface, and a second electrode disposed on the lateral surface; mounting the light-emitting element and electrically connecting the first electrode to the first wiring; forming a resin member on the substrate and covering the light-emitting element; exposing an upper portion of the light-emitting element from an upper surface of the resin member such that the second electrode is partially exposed by removing an upper portion of the resin member; and forming a second wiring on the upper surface of the resin member excluding a portion of the light-emitting element exposed from the resin member and electrically connecting the second wiring to the second electrode.

    Light emitting device
    3.
    发明授权
    Light emitting device 有权

    公开(公告)号：US10510934B2

    公开(公告)日：2019-12-17

    申请号：US15364657

    申请日：2016-11-30

    申请人： NICHIA CORPORATION

    发明人： Masakatsu Tomonari ,  Masahiko Sano

    IPC分类号： H01L33/54 ,  H01L33/50 ,  H01L25/075 ,  H01L33/46 ,  H01L33/58 ,  H01L33/60 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/62 ,  H01L33/64 ,  H01L33/48

    摘要： A light emitting device includes one or more light emitting elements, a light transmissive member, and a light reflective member. The one or more light emitting elements each includes an upper surface. The light transmissive member has an upper surface and a lower surface. The light reflective member covers surfaces of the light transmissive member and lateral surfaces of the one or more light emitting elements so as to expose the upper surface of the light transmissive member. The upper surface area of the light transmissive member is smaller than a sum of the upper surface areas of the one or more light emitting elements, and the lower surface area of the light transmissive member is larger than a sum of the upper surface areas of the one or more light emitting elements.

    Semiconductor light emitting element
    5.
    再颁专利
    Semiconductor light emitting element 有权

    公开(公告)号：USRE49406E1

    公开(公告)日：2023-01-31

    申请号：US16508063

    申请日：2019-07-10

    申请人： NICHIA CORPORATION

    发明人： Masahiko Sano ,  Takahiko Sakamoto ,  Keiji Emura ,  Katsuyoshi Kadan

    IPC分类号： H01L33/38 ,  H01L33/46 ,  H01L33/40 ,  H01L33/42 ,  H01L33/44

    摘要： The present invention provides a light emitting element capable or realizing at least one of lower resistance, higher output, higher power efficiency (1 m/W), higher mass productivity and lower cost of the element using a light transmissive electrode for an electrode arranged exterior to the light emitting structure. A semiconductor light emitting element includes a light emitting section, a first electrode and a second electrode on a semiconductor structure including first and second conductive type semiconductor layers, the first and the second electrodes respectively including at least two layers of a first layer of a light transmissive conductive film conducting to the first and the second conductive type semiconductor and a second layer arranged so as to conduct with the first layer. First and second light transmissive insulating films are respectively arranged so as to overlap at least one part of the first and the second layers.

    Nitride semiconductor element and method for manufacturing the same
    9.
    发明授权
    Nitride semiconductor element and method for manufacturing the same 有权

    公开(公告)号：US10263152B2

    公开(公告)日：2019-04-16

    申请号：US15714791

    申请日：2017-09-25

    申请人： NICHIA CORPORATION

    发明人： Tomohiro Shimooka ,  Masahiko Sano ,  Naoki Azuma

    IPC分类号： H01L29/06 ,  H01L33/32 ,  H01L33/00 ,  H01L33/02 ,  H01L33/20 ,  H01L33/12 ,  H01L33/16

    摘要： A nitride semiconductor element includes a sapphire substrate including: a main surface extending in a c-plane of the sapphire substrate, and a plurality of projections disposed at the main surface, the plurality of projections including at least one projection having an elongated shape in a plan view; and a nitride semiconductor layer disposed on the main surface of the sapphire substrate. The at least one projection has an outer edge extending in a longitudinal direction of the elongated shape, the outer edge extending in a direction oriented at an angle in a range of −10° to +10° with respect to an a-plane of the sapphire substrate in the plan view.